Zobrazeno 1 - 10
of 12
pro vyhledávání: '"Noritsuka Mizumura"'
Autor:
Koji SASAKI, Noritsuka MIZUMURA
Publikováno v:
Journal of the Japan Society of Powder and Powder Metallurgy. 67:471-477
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f1f9d186e682f73c9689d436d008a221
https://doi.org/10.2497/jjspm.67.471
https://doi.org/10.2497/jjspm.67.471
Publikováno v:
MATERIALS TRANSACTIONS. 59:612-619
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5a71acf5d75c077e06b85cd2f767065c
https://doi.org/10.2320/matertrans.m2017392
https://doi.org/10.2320/matertrans.m2017392
Publikováno v:
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
The exponent of the fatigue crack propagation law of the sintered Ag was decreased with an increase in temperature. The decreasing the exponent was related to the viscous behavior of the grain boundaries. However, the exponent increased again at 473K
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::42a8f273caee711c76f31653c721bc57
https://doi.org/10.23919/ltb-3d.2019.8735315
https://doi.org/10.23919/ltb-3d.2019.8735315
Publikováno v:
2019 International Conference on Electronics Packaging (ICEP).
This paper will discuss the fundamental study on nano-silver die attach newly developed with a unique approach using MO (Metallo-organic) technology.Nano-silver provides a low-temperature sintering capability. The nano-silver die attach shows high th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ce6262dfff91df62a2691d75ab329cc6
https://doi.org/10.23919/icep.2019.8733488
https://doi.org/10.23919/icep.2019.8733488
Publikováno v:
Journal of Electronic Materials. 46:1155-1162
The low-cycle fatigue life and fatigue crack propagation behavior of sintered silver nanoparticles were investigated using miniature specimens sintered at two different temperatures. The fatigue crack initiation life and fatigue crack propagation rat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ea8925fa14e9245ebff30faeb418aca6
https://doi.org/10.1007/s11664-016-5068-2
https://doi.org/10.1007/s11664-016-5068-2
Publikováno v:
Journal of Smart Processing. 5:259-265
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b2835d13aac8056d7f37435d82361224
https://doi.org/10.7791/jspmee.5.259
https://doi.org/10.7791/jspmee.5.259
Publikováno v:
2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition.
This paper will discuss the fundamental study on nano-silver die attach pastes newly developed with a unique approach using MO (Metallo-organic) technology. MO technology provides a low-temperature sintering capability. The nano-silver pastes show hi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cfb8081278e12e2daa78a90b8e6a2648
https://doi.org/10.23919/empc.2017.8346875
https://doi.org/10.23919/empc.2017.8346875
Autor:
Noritsuka Mizumura, Koji Sasaki
Publikováno v:
2017 IEEE 17th International Conference on Nanotechnology (IEEE-NANO).
This paper will discuss the fundamental study on nano-silver pastes newly developed with a unique approach using MO (Metallo-organic) technology. MO technology provides a low-temperature sintering capability. The nano-silver pastes show high electric
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5b0d40b0a496aebf9dc5d97295d9d7c5
https://doi.org/10.1109/nano.2017.8117398
https://doi.org/10.1109/nano.2017.8117398
Publikováno v:
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
The effects of temperatures on the rate of pressure-less sintered fatigue crack propagation were investigated in this study. For each test temperature, the Dowling-Begley's fatigue crack propagation law held true. Temperature effects on the behavior
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::add2c102648c822771fc18a32a3a3d71
https://doi.org/10.23919/ltb-3d.2017.7947482
https://doi.org/10.23919/ltb-3d.2017.7947482
Publikováno v:
Journal of Smart Processing. 2:160-165
The operating temperature of power devices including next generation IGBTs (Insulated Gate Bipolar Transistors) has been predicted to become higher than 473K . For this reason, for die bonding, in place of traditional Pb rich solder alloys with high
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::55a4657f805ff0507b115325d53d192d
https://doi.org/10.7791/jspmee.2.160
https://doi.org/10.7791/jspmee.2.160