Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Norio Moriike"'
Autor:
Akira Kawai, Norio Moriike
Publikováno v:
Microelectronic Engineering. :683-692
Quantitative analysis of the collapse property of dot resist pattern formed by ArF excimer laser lithography ranging from 141 to 405 nm diameter and 360 nm height is demonstrated experimentally. By directly applying a load to a top corner of the resi
Autor:
Akira Kawai, Norio Moriike
Publikováno v:
Journal of Photopolymer Science and Technology. 14:507-512
By directly applying load to a top corner of dot resist pattern with a microcantilever tip, a dot pattern adhering on a substrate can be deformed and collapsed easily. The elastic and adhesion properties of a dot resist pattern can be analyzed quanti
Autor:
Norio Moriike, Akira Kawai
Publikováno v:
Journal of The Adhesion Society of Japan. 36:295-301
Autor:
Akira Kawai, Norio Moriike
Publikováno v:
Journal of The Adhesion Society of Japan. 36:404-407
Publikováno v:
Proceedings Electronic Components and Technology, 2005. ECTC '05..
A new profile-free copper foil has been developed whose surface roughness is Rz
Autor:
Akira Kawai, Norio Moriike
Publikováno v:
Journal of Photopolymer Science and Technology. 14:751-752