Zobrazeno 1 - 10
of 55
pro vyhledávání: '"Norio Chujo"'
Publikováno v:
Applied Sciences, Vol 8, Iss 1, p 137 (2018)
A 25.78-Gbit/s × 4-ch active optical cable (AOC) with an ultra-compact form factor is proposed. The size of the proposed AOC is 5.2 cm3, which is 55% smaller than the standard form factor of Quad Small Form-factor Pluggable (QSFP28), and 45% smaller
Externí odkaz:
https://doaj.org/article/ba1b890a40e14b099629a4ca0cfdc978
Publikováno v:
IEEE Transactions on Electron Devices. 67:4606-4610
This article proposes a 3-D-based redundancy scheme for the stacked dynamic random-access memory (DRAM) systems, which enables highly efficient productivity with the wafer-on-wafer (WOW) technology. Vertically replaceable block scheme and redundantly
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::98fd7674e902ea362f6a684f9782dce3
https://doi.org/10.1109/ted.2020.3010894
https://doi.org/10.1109/ted.2020.3010894
Publikováno v:
2021 IEEE Asia Pacific Conference on Circuit and Systems (APCCAS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d3ce2e70f2f60ff6e0c0c6536ccab793
https://doi.org/10.1109/apccas51387.2021.9687625
https://doi.org/10.1109/apccas51387.2021.9687625
Publikováno v:
Extended Abstracts of the 2020 International Conference on Solid State Devices and Materials.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1029b7e35b8073608779f5645c023479
https://doi.org/10.7567/ssdm.2020.c-4-03
https://doi.org/10.7567/ssdm.2020.c-4-03
Publikováno v:
2020 IEEE Symposium on VLSI Technology.
The superior electrical performance of 3D integration (3DI) with bumpless wafer-on-wafer (WOW) was clarified by 3D electromagnetic (EM) field analysis. We propose a high parallelism stacked memory, named “BBCube”, using WOW. In comparison with co
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8c0417f63491b7387bda7348a8b01f99
https://doi.org/10.1109/vlsitechnology18217.2020.9265038
https://doi.org/10.1109/vlsitechnology18217.2020.9265038
Publikováno v:
Electronics, Vol 11, Iss 236, p 236 (2022)
Bumpless Build Cube (BBCube) using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI) is discussed. Bumpless interconnects between wafers and between chips and wafers are a second-generation alternative to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::73e7390241b95ddcf9e629948f3856a0
https://doi.org/10.3390/electronics11020236
https://doi.org/10.3390/electronics11020236
Publikováno v:
IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences. :402-409
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::95fc56c21382c7a4d886ef246890ae3e
https://doi.org/10.1587/transfun.e101.a.402
https://doi.org/10.1587/transfun.e101.a.402
Autor:
Yong Lee, Toshiaki Takai, Shinji Komatsuzaki, Kinya Yamazaki, Masataka Sato, Naohiro Kohmu, Norio Chujo, Yoshinori Sunaga, Hideo Arimoto, Yasunobu Matsuoka, Akira Ogura
Publikováno v:
IEEE Photonics Technology Letters. 29:334-337
A prototype compact 310-Gb/s (25.78-Gb/s × 12-ch) parallel-optical-transceiver module for large-capacity and high-density optical interconnects was fabricated. The structure of the optical module provides efficient heat dissipation and high optical-
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::22ba3e88795a248cba83492c075a35fa
https://doi.org/10.1109/lpt.2017.2648823
https://doi.org/10.1109/lpt.2017.2648823
Autor:
Norio Chujo
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 20:329-331
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fd8c051e54044dbe92d2e2c83f8ac00e
https://doi.org/10.5104/jiep.20.329
https://doi.org/10.5104/jiep.20.329
Publikováno v:
2018 IEEE CPMT Symposium Japan (ICSJ).
A 53-Gbit/s VCSEL-based compact optical module is proposed. In order to realize 50-Gbit/s-class optical transmission, high-bandwidth optical devices are important. Accordingly, the feasibilities of a high speed optical circuit applying high-bandwidth
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7c2a24d5dab323de08173ba5bc5a4144
https://doi.org/10.1109/icsj.2018.8602685
https://doi.org/10.1109/icsj.2018.8602685