Zobrazeno 1 - 10
of 19
pro vyhledávání: '"Norhanani Binte Jaafar"'
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a19df7c3675e8f66ed0d99173e62702b
https://doi.org/10.1109/eptc56328.2022.10013237
https://doi.org/10.1109/eptc56328.2022.10013237
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eac1b73f080394ec9a1e5676e9d8e55e
https://doi.org/10.1109/eptc53413.2021.9663939
https://doi.org/10.1109/eptc53413.2021.9663939
Autor:
Weiguo Chen, Yuan Hsing Fu, Doris K. T. Ng, Yuan Gao, Lennon Yao Ting Lee, Norhanani Binte Jaafar, Tan-Tan Zhang, Eldwin J. Ng, Hong Cai, Linfang Xu, Li-Yan Siow, Chong-Pei Ha, Qingxin Zhang
Publikováno v:
2021 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers).
CO 2 gas sensing responses are measured using our in-house fabricated CMOS-MEMS ScAlN-based pyroelectric detector with 12% Sc doped concentration. Leveraging on mid-IR absorption behavior of CO 2 gas caused by interaction of CO 2 with light at 4.26
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5ba14dcf9bdf137392577a0444cc8045
https://doi.org/10.1109/transducers50396.2021.9495707
https://doi.org/10.1109/transducers50396.2021.9495707
Autor:
Norhanani Binte Jaafar, Tai Chong Chai, Ser Choong Chong, Sharon Pei Siang Lim, Sharon Seow Huang Lim
Publikováno v:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).
The Fan-out wafer-level packaging technology is an integrated circuit technology as well as an enhancement of standard wafer-level packaging (WLP) solutions. This technology is an attractive packaging approach for mobile applications and heterogeneou
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6226621c2863197ee9b103cdff15c873
https://doi.org/10.1109/eptc50525.2020.9315079
https://doi.org/10.1109/eptc50525.2020.9315079
Publikováno v:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).
Current industry trends in the microelectronics packaging is going towards increasing in I/O density and small size packaging. Common use of solder material in packaging are the lead free solders. The popular lead free alloys include the SnAgCu (SAC)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::87c07a044c3c6bfc8769c8010d59afee
https://doi.org/10.1109/eptc50525.2020.9315175
https://doi.org/10.1109/eptc50525.2020.9315175
Autor:
Li Yan Siow, Qingxin Zhang, Yuan Gao, Lennon Yao Ting Lee, Hong Cai, Linfang Xu, Eldwin J. Ng, Yuan Hsing Fu, Norhanani Binte Jaafar, Doris K. T. Ng, Chong Pei Ho, Tan-Tan Zhang, Weiguo Chen
Publikováno v:
Sensors and Actuators B: Chemical. 346:130437
We demonstrate NDIR CO2 gas sensing using CMOS compatible MEMS ScAlN-based pyroelectric detectors. The ScAlN-based pyroelectric detectors are fabricated using 8-inch wafer level technology with 12 % Sc-doped AlN deposited at a temperature of ∼200
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::52fe78758c0a2eca753fdd28a3d04f4b
https://doi.org/10.1016/j.snb.2021.130437
https://doi.org/10.1016/j.snb.2021.130437
Publikováno v:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
In the recent years, the industry is moving towards finer, higher density interconnections and better electrical performance from the die to the substrate. The 3D stack assembly using through silicon via (TSVs) has been emerging as a good solution by
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5eb843e0c2e97c6feec7e374b1f0d9e4
https://doi.org/10.1109/eptc47984.2019.9026720
https://doi.org/10.1109/eptc47984.2019.9026720
Publikováno v:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
SnAgCu305 (SAC305) solder alloy is extensively used as solder bump interconnects in industry due to their high strength and good reliability performance. SAC305 solder bump is applicable both to 1st and 2nd level solder interconnects. It connects the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f71b5dec6e39f8366ac7208cbb8b3f89
https://doi.org/10.1109/eptc47984.2019.9026678
https://doi.org/10.1109/eptc47984.2019.9026678
Publikováno v:
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
Laser solder ball jetting is tremendously flexibility along with its advantages of no mechanical stress and low thermal on the processes packages during the assembly process. In comparison to reflow soldering using conventional method, laser reflow i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1e30fb6b4fbb27334f9f2fb68a623ff0
https://doi.org/10.1109/eptc.2018.8654294
https://doi.org/10.1109/eptc.2018.8654294
Publikováno v:
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).
Wire bonding is still popular and leading interconnect technologies due to its reliability, reputation for versatility and performance. Increased demand for disposal medical sensors, miniaturization for portable electronic equipment and specialty par
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::28604d19e6d5b9520dc263160d0f7483
https://doi.org/10.1109/eptc.2017.8277435
https://doi.org/10.1109/eptc.2017.8277435