Zobrazeno 1 - 10
of 95
pro vyhledávání: '"Nobuyuki SHISHIDO"'
Autor:
Masaru OGAWA, Tetsuya MATSUDA, Keita GOTO, Nobuyuki SHISHIDO, Keiichi SHIRASU, Osamu TAKAKUWA, Akihiro TAKEZAWA, Naoki MATSUDA
Publikováno v:
Mechanical Engineering Journal, Vol 11, Iss 4, Pp 24preface2-24preface2 (2024)
Externí odkaz:
https://doaj.org/article/c97739ac7778433e88b12058c0b5aca0
Autor:
Kazunori Hasegawa, Kanta Hara, Nobuyuki Shishido, Satoshi Nakano, Wataru Saito, Tamotsu Ninomiya
Publikováno v:
Power Electronic Devices and Components, Vol 7, Iss , Pp 100061- (2024)
This paper presents a power-cycling degradation monitoring method of an IGBT module with a VCE(sat) sensing circuit and junction temperature prediction by a three-dimensional structure model. A chopper circuit was introduced to provide a continuous-c
Externí odkaz:
https://doaj.org/article/3d377ab792d04205acba779def0fb4dc
Publikováno v:
Nanomaterials, Vol 11, Iss 9, p 2201 (2021)
Generally, hard ceramic carbide particles, such as B4C and TiC, are angulated, and particle size control below the micrometer scale is difficult owing to their hardness. However, submicrometer particles (SMPs) with spherical shape can be experimental
Externí odkaz:
https://doaj.org/article/bef3c2b723ed4ed996dfa41bdc30789d
Autor:
Masaaki Koganemaru, Nobuyuki Shishido, Tomoki Sakaguchi, Masaya Kato, Toru Ikeda, Yutaka Hayama, Seiya Hagihara, Noriyuki Miyazaki
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 25:260-268
Autor:
Seiya Hagihara, Yutaka Hayama, Masaaki Koganemaru, Noriyuki Miyazaki, Tomoki Sakaguchi, Nobuyuki Shishido
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 24:560-571
Autor:
Nobuyuki Shishido, Shoji Kamiya, Tomohito Sekine, Shizuo Tokito, Toru Ikeda, Masaaki Koganemaru, Koji Hidaka, Takeo Minari
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 24:586-594
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 23:173-191
Publikováno v:
SiC Power Module Design: Performance, Robustness and Reliability ISBN: 9781785619076
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::350f7a064ae0ae00fc1e0af4c7bd6a8f
https://doi.org/10.1049/pbpo151e_ch8
https://doi.org/10.1049/pbpo151e_ch8
Publikováno v:
Nanomaterials
Volume 11
Issue 9
Nanomaterials, Vol 11, Iss 2201, p 2201 (2021)
Volume 11
Issue 9
Nanomaterials, Vol 11, Iss 2201, p 2201 (2021)
Generally, hard ceramic carbide particles, such as B4C and TiC, are angulated, and particle size control below the micrometer scale is difficult owing to their hardness. However, submicrometer particles (SMPs) with spherical shape can be experimental
Publikováno v:
IEEE Journal of Emerging and Selected Topics in Power Electronics. 7:1604-1614
Power modules are utilized for electric power control and play a key role in efficient energy conversion. A structural reliability problem of wire bonding, wire-liftoff, in power modules becomes important at high-temperature operation. Wire-liftoff i