Zobrazeno 1 - 10
of 29
pro vyhledávání: '"Nobuyuki Negishi"'
Publikováno v:
Precision Engineering. 44:87-92
A novel wafer temperature control system using direct expansion cycles is developed to improve etching performance. This system enables rapid temperature control of a wafer with low power consumption. In a previous report, we confirmed that the etchi
Autor:
Daisuke Ogawa, Mitsuhiro Omura, Taku Iwase, Haruka Suzuki, Shota Nunomura, Yasushi Sonoda, Kazuo Takahashi, Nobuyuki Kuboi, Takayoshi Tsutsumi, Kenji Ishikawa, Yoshito Kamaji, Tomohiro Nozaki, Kenichi Yoshikawa, Tetsuji Shimizu, Kazunori Shinoda, Nobuyuki Negishi, Tatsuo Ishijima, Song-Yun Kang, Moritaka Nakamura, Kazunori Koga
Publikováno v:
Japanese Journal of Applied Physics. 58:SE0802
Autor:
Moritaka Nakamura, Kazunori Koga, Kazunori Shinoda, Shota Nunomura, Yoshito Kamaji, Yasushi Sonoda, Kazuo Takahashi, Kenichi Yoshikawa, Tomohiro Nozaki, Song-Yun Kang, Kenji Ishikawa, Daisuke Ogawa, Takayoshi Tsutsumi, Nobuyuki Kuboi, Tatsuo Ishijima, Tetsuji Shimizu, Taku Iwase, Haruka Suzuki, Mitsuhiro Omura, Nobuyuki Negishi
Publikováno v:
Japanese Journal of Applied Physics. 58:SE0803
Autor:
Daisuke Ogawa, Tomohiro Nozaki, Tatsuo Ishijima, Moritaka Nakamura, Kazunori Koga, Kazunori Shinoda, Song-Yun Kang, Taku Iwase, Haruka Suzuki, Kazuo Takahashi, Nobuyuki Negishi, Takayoshi Tsutsumi, Nobuyuki Kuboi, Shota Nunomura, Kenichi Yoshikawa, Kenji Ishikawa, Mitsuhiro Omura, Yoshito Kamaji, Tetsuji Shimizu, Yasushi Sonoda
Publikováno v:
Japanese Journal of Applied Physics. 58:SE0804
Publikováno v:
Journal of the Japan Society for Precision Engineering. 78:523-527
Publikováno v:
Japanese Journal of Applied Physics. 57:106201
Publikováno v:
Japanese Journal of Applied Physics. 46:7870-7874
The bowing mechanism in high-aspect-ratio contact hole (HARC) etching was investigated by taking into account reactive sticking on the sidewall of the hole. Sticking coefficients of radicals on the sidewall have been estimated by comparing the observ
Autor:
Masatoshi Oyama, Masaru Izawa, Tadamitsu Kanekiyo, Nobuyuki Negishi, Kenetsu Yokogawa, Masatoshi Miyake
Publikováno v:
Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena. 35:051205
The hypothetical mechanism of bottom profile degradation, such as distortion and twisting in high aspect ratio feature etching, was verified based on the pattern transfer observation of etched pattern. The authors mainly focused on trench pattern sam
Publikováno v:
Japanese Journal of Applied Physics. 56:06HB07
In this study, atomic layer etching (ALE) of silicon nitride (SiN) using a cyclic process with monofluoromethane chemistry was investigated. Results show that an appropriate desorption time must be chosen at a specific adsorption time to achieve SiN
Autor:
Kenji Maeda, Yasushi Sonoda, Masaru Hori, Tiffany Saldana, M Miura, Kazumasa Okuma, Jim Manos, Kenji Ishikawa, Masaru Izawa, Masaru Kurihara, N Yasui, Motohiro Tanaka, Yohei Ishii, Kazunori Shinoda, Hiroyuki Kobayashi, Nobuya Miyoshi, Nobuyuki Negishi
Publikováno v:
Journal of Physics D: Applied Physics. 50:194001
The demand for precisely controlled etching is increasing as semiconductor device geometries continue to shrink. To fulfill this demand, cyclic atomic level/layer etching will become one of the key technologies in semiconductor device manufacturing a