Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Nobutoshi Saito"'
Publikováno v:
IEEE Power and Energy Magazine. 16:46-56
After the 2011 large-scale earthquake and nuclear accident in Japan, the Japanese government held a nationwide discussion to determine how the traditional energy policy and electricity system should be reformed to.
Publikováno v:
Japanese Journal of Radiological Technology. 73:258-266
Objective To study whether the actual radiation exposure is different between computed tomography (CT) scanners and medical centers when the same patient is scanned, we investigated the actual effective doses for a whole body (Chest-Pelvis) CT scan i
Publikováno v:
Nihon Hoshasen Gijutsu Gakkai zasshi. 75(12)
This research measured the radiation exposure of the computed tomography(CT) localizer radiograph of the trunk of the body. The entrance surface dose for CT localizer radiograph was measured using radiophotoluminescent glass dosimeter(RPLD) on four p
Autor:
Hiroki Anzai, Nobutoshi Saito, Dai Kato, Osamu Niwa, Kyoko Yoshioka, Sayaka Ishihara, Shunsuke Shiba
Publikováno v:
Journal of Electroanalytical Chemistry. 779:86-91
An electrochemical drug metabolizing sensor device was fabricated with a patterned electrode of polycrystalline indium tin oxide (pITO) film and a poly(dimethylsiloxane) (PDMS) thin layer microchannel. The pITO film is known to be suitable as an elec
Publikováno v:
IEEJ Transactions on Power and Energy. 126:869-877
Autor:
Akira Owatari, Mizuki Nagai, Akira Fukunaga, Shimoyama Masashi, Yusuke Tamari, Fumio Kuriyama, Nobutoshi Saito, Catherine Moore
Publikováno v:
2009 59th Electronic Components and Technology Conference.
Electroplating technology for via filling with copper for three-dimensional packaging is one of the strong candidates. The Cu electroplating technology for perfect via filling is discussed in this paper. A plating solution was prepared, in which plat
Publikováno v:
Proceedings Electronic Components and Technology, 2005. ECTC '05..
In lead-free alloy electroplating for Sn-Ag, Sn-Cu or Sn-Ag-Cu solder bumping, composition control is an important subject since the composition ratio is influential to the alloy structures and properties of the solders. The general assumption is tha
Publikováno v:
ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258).
Eutectic tin-silver (Sn-Ag), tin-copper (Sn-Cu), and tin-silver-copper (Sn-Ag-Cu) solder alloys are potential lead-free materials for low-temperature processing of solder bumps on wafers. But, before they can be adopted to replace the existing lead-f
Publikováno v:
Journal of Life Support Technology. 5:99-101
A method of detection of the gazing direction is proposed. It is shown that the gazing direction can be determined from the distance between the images by the corneal and the scleral reflections. This method can be applied to an off-body eye tracker.
Autor:
Fumio Kuriyama, Nobutoshi Saito, Yusuke Tamari, Masanori Goto, Mizuki Nagai, Masashi Shimoyama
Publikováno v:
The Proceedings of Conference of Kanto Branch. :103-104