Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Nobutake Tsuyuno"'
Publikováno v:
Journal of Photopolymer Science and Technology. 30:211-215
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::da4cc3e8cea063a59edbddd3add7ff59
https://doi.org/10.2494/photopolymer.30.211
https://doi.org/10.2494/photopolymer.30.211
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 29:213-221
Applications in the automotive field present some of the harshest environments for electrical components, especially for plastic packaging devices. Encapsulation technology by epoxy molding compounds is widely used for integrated circuit and large-sc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d77d63dd1389b82315625a5c563b57a9
https://doi.org/10.1109/tcapt.2006.870391
https://doi.org/10.1109/tcapt.2006.870391
Publikováno v:
KOBUNSHI RONBUNSHU. 52:286-293
代表的なメソゲン基の一つであるビフェニルエーテルを骨格とするビフェノール型エポキシ樹脂の動力学的および力学的性質に対する硬化剤中の活性水素の立体配置の影響が検討された.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0fa6f171d0f5d47e66c16423ef6c9bf4
https://doi.org/10.1295/koron.52.286
https://doi.org/10.1295/koron.52.286
Publikováno v:
2012 2nd IEEE CPMT Symposium Japan.
When using a thermal sheet for cooling, heat-generating components are pressed strongly against the thermal sheet to maximize the contact area and reduce the thermal sheet thickness. However, such pressure can reduce the reliability of the solder joi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6317a2836374e05c9068dc2641b44a1d
https://doi.org/10.1109/icsj.2012.6523474
https://doi.org/10.1109/icsj.2012.6523474