Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Nobukazu Kondo"'
Publikováno v:
Journal of Porous Materials. 6:255-258
Woodceramics have recently attracted much attention as ecomaterials at low cost. Electrical properties of the woodceramics (WCM hereafter) have been characterized in the range 10–70% relative humidity and for temperatures from −20 to 100°C. The
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b5bae5d9791f9748928c8831667dec82
https://doi.org/10.1023/a:1009644316468
https://doi.org/10.1023/a:1009644316468
Autor:
Nobukazu Kondo, Yoshiomi Kondoh
Publikováno v:
Journal of the Physical Society of Japan. 65:1264-1269
An attractor of dissipative structures in solitons described by the Korteweg-de Vries (K-dV) equation with a viscous dissipation term is investigated, with the use of an eigenfunction spectrum analysis associated with the dissipative dynamical operat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::53faf3e8d0789e272fd5e70daa8d6b12
https://doi.org/10.1143/jpsj.65.1264
https://doi.org/10.1143/jpsj.65.1264
Autor:
Koyu Asai, Tadahiro Kuroda, Masayuki Mizuno, Shintaro Yamamichi, Yukihiro Urakawa, Ramchan Woo, Nobukazu Kondo, Jae Dong Kim, Masayuki Miyamoto
Publikováno v:
2008 IEEE Asian Solid-State Circuits Conference.
Up to now, SiP integration is widely used to increase chip integration density as well as flexibility of combination in heterogeneous devices. Emerging integration and stacking technologies such as 3D integration, TSV (Through Silicon Via), die-to-di
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f4985bad182652d3d0c2a9f86fb01049
https://doi.org/10.1109/asscc.2008.4708832
https://doi.org/10.1109/asscc.2008.4708832
Autor:
Tadahiro Kuroda, Masayuki Mizuno, Ramchan Woo, Nobukazu Kondo, Yukihiro Urakawa, Masayuki Miyamoto, Koyu Asai, Shintaro Yamamichi, Jae Dong Kim
Publikováno v:
2008 IEEE Asian Solid-State Circuits Conference; 2008, p485-485, 1p