Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Nobuhito Komuro"'
Autor:
Masaya Toba, Kazuyuki Mitsukura, Takashi Masuko, Nobuhito Komuro, Kazuhiko Kurafuchi, Shuji Nomoto, Shinichiro Abe
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 17:45-51
Semiconductor packages for high-performance devices with printed circuit boards having multiwiring layers such as flip-chip ball grid array have been attracting the attention to realize ultrare-liable and low-latency communications in 5G networking.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2910148476e4284f1c597a98e7a94cd3
https://doi.org/10.4071/imaps.1100914
https://doi.org/10.4071/imaps.1100914
Autor:
Hayato Sawamoto, Yuta Daijima, Toshimasa Nagoshi, Yoshikazu Suzuki, Nakamura Akihiro, Shuji Nomoto, Toshizumi Yoshino, Nobuhito Komuro
Publikováno v:
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
As the functionality of electronic devices is becoming higher, semiconductors with multiple pins and thinner packages are dramatically proceeding. For the photo sensitive insulation is tied to be used for those devices, high reliability such as crack
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::03eaca63ca44b4fb95dfd3098f98dabb
https://doi.org/10.1109/eptc.2018.8654403
https://doi.org/10.1109/eptc.2018.8654403
Publikováno v:
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).
The solder resist is an ink which covers the surface of the printed wiring board (PWB) and serves as an insulating film for protecting the circuit pattern. “Resist” has the role of preventing solder (= solder) from adhering to unnecessary parts i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fb527c52e0937e91c827546bc1933f5b
https://doi.org/10.1109/eptc.2017.8277582
https://doi.org/10.1109/eptc.2017.8277582
Autor:
Masaya Toba, Shuji Nomoto, Nobuhito Komuro, Kazuyuki Mitsukura, Shinichiro Abe, Takashi Masuko, Kazuhiko Kurafuchi
Publikováno v:
Advancing Microelectronics; Jul/Aug2020, Vol. 47 Issue 4, p6-11, 6p