Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Nobuhiko Yamagishi"'
Publikováno v:
Japanese Journal of Applied Physics. 47:2797-2800
Wireless power delivery between stacked chips makes system in a package (SiP) more compact and reconfigurable. However, to reduce the ripple of recovered voltage, a large on-chip filter capacitor is required, which is chip-area-inefficient. A multiph
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a5e5f9919dfe380668a18247f6ac0cc7
https://doi.org/10.1143/jjap.47.2797
https://doi.org/10.1143/jjap.47.2797
Publikováno v:
Japanese Journal of Applied Physics. 45:3286-3289
An inductive inter-chip wireless communication scheme in three-dimensional (3D) stacked chip has been reported to achieve high-speed, low-power, and low-cost inter-chip communication. In this scheme, inductive coupling becomes a fundamental of commun
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4cedade9baf5084f55a80b1f1908b09d
https://doi.org/10.1143/jjap.45.3286
https://doi.org/10.1143/jjap.45.3286