Výsledky vyhledávání - "Nobuhiko Chiwata"

Development of Fe-based high Bs nanocrystalline alloy powder

Publikováno v: Journal of Magnetism and Magnetic Materials. 509:166838

We developed nanocrystalline powders with high Fe contents through methodological and compositional innovations. The Fe-Cr-Cu-Si-B-Sn powders exhibit high Bs of 1.55 T–1.60 T and core losses of 4800–8000 kW/m3 at 2 MHz under 30 mT, P0.2/3M. The C

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::fda1bd2b4038fa4ff995d4decb573124
https://doi.org/10.1016/j.jmmm.2020.166838

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Use of Modified Accumulated Damage Model to Predict Fatigue Failure Lives of Sn-Ag-Cu-based Solder Joints in Ball-Grid-Array-Type Packages

Autor: Takeshi Terasaki, Hisashi Tanie, Motoki Wakano, Nobuhiko Chiwata, Masaru Fujiyoshi

Publikováno v: Transactions of The Japan Institute of Electronics Packaging. 5:1-11

We have developed a modified accumulated damage model that can be used to predict fatigue failure lives of solder joints in electronic devices. Our model calculates the fatigue failure life of solder on the basis of the damage that accumulates during

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::25ed8c1bf3219d57045484ec08cf2b75
https://doi.org/10.5104/jiepeng.5.1

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Current density redistribution from no current crowding to current crowding in Pb-free solder joints with an extremely thick Cu layer

Autor: Daechul Choi, Jung Kyu Han, Nobuhiko Chiwata, King-Ning Tu, Masaru Fujiyoshi

Publikováno v: Acta Materialia. 60:102-111

In order to remove the effect of current crowding on electromigration, thick Cu under-bump metallization has been widely adopted in the electronics industry. Three-dimensional (3-D) integrated circuits, using through Si via Cu column interconnects, i

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::029b4c14d07803329c5428d89fa09085
https://doi.org/10.1016/j.actamat.2011.09.023

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Void Growth Analysis of Flip-Chip Solder Joint by Using Electromigration Failure Simulation and Synchrotron Radiation X-Ray Microtomography

Autor: Masaru Fujiyoshi, Yu Harubeppu, Hisashi Tanie, Hiroshi Shintani, Nobuhiko Chiwata, Shinichi Fujiwara

Publikováno v: Journal of The Japan Institute of Electronics Packaging. 15:541-549

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::f732664c86e5e942b4fcb084173c05f6
https://doi.org/10.5104/jiep.15.541

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In situ TEM observation of long range ordering via short range order in Cu3Pt

Autor: Nobuhiko Chiwata, Noriyuki Kuwano, Kensuke Oki

Publikováno v: Bulletin of Materials Science. 22:697-700

The thermoequilibrium state of short range order (SRO) and the ordering process to the long range order (LRO) phase in Cu3Pt have been studied by thein situ transmission electron microscope (TEM) observation method. It is confirmed that the alloy has

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::53ba068ad2d17b57519ad9838d8cd354
https://doi.org/10.1007/bf02749988

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In-situ TEM Observation of Phase Transformation Processes in Cu3Pt with a Long-Period Superstructure

Autor: Akiyoshi Matsumoto, Kouichi Matsuno, Kensuke Oki, Nobuhiko Chiwata, Noriyuki Kuwano

Publikováno v: Journal of Electron Microscopy. 45:442-447

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::f91075ba51384ed5a6ad680654c6f5f9
https://doi.org/10.1093/oxfordjournals.jmicro.a023463

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Electromigration failure analysis of flip-chip solder joint by using void growth simulation and synchrotron radiation X-ray microtomography

Autor: Masaru Fujiyoshi, Hisashi Tanie, Shinichi Fujiwara, Hiroshi Shintani, Nobuhiko Chiwata, Yu Harubeppu

Publikováno v: 2012 4th Electronic System-Integration Technology Conference.

Electromigration (EM) failures of flip-chip solder joints due to void growth, resulting from miniaturization of joint structure, have recently been reported. In addition, growth behavior of electromigration voids in solder joints has not been clarifi

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::3b5f12194b089a25b1252adedc4c1e51
https://doi.org/10.1109/estc.2012.6542076

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207 Thermal Deformation Mechanism of Ceramic Substrate for Next-generation Power Semiconductor Modules

Autor: Hiroyuki Teshima, Nobuhiko Chiwata, Yu Harubeppu, Koji Sasaki, Hisashi Tanie

Publikováno v: The Proceedings of Ibaraki District Conference. :109-110

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::b5d44a2835b54cf33c7ca423858cfad8
https://doi.org/10.1299/jsmeibaraki.2015.23.109

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Electromigration in Copper-Core Solder Ball Joints During Thermal Cycle Tests

Autor: Nobuhiko Chiwata, Motoki Wakano, Hisashi Tanie, Masaru Fujiyoshi, Shinichi Fujiwara

Publikováno v: ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2.

Electromigration current densities in Cu and Al lines on a silicon die exceed 1.0 × 106 A/cm2 . However, solder joints can only withstand electromigration current densities below about 1.0 × 104 A/cm2 . Thus, electromigration in solder joints will

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::067bdd3975235c222d88c53e6f5b7cd6
https://doi.org/10.1115/ipack2011-52110

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