Zobrazeno 1 - 10
of 21
pro vyhledávání: '"Noboru Asahi"'
Publikováno v:
3DIC
We report on a thermal compression postbonder (PB3000W) that can simultaneously bond 2-6 cubes and an eight-layer stacked integrated circuit on a wafer in a two-step bonding process. This bonder can perform both collective bonding and gang bonding. T
Autor:
Mikio Kawakami, Katsumi Terada, Hashimoto Yasunori, Hiroto Tanaka, Yoshihito Mizutani, Imai Koichi, Toshiyuki Jinda, Noboru Asahi
Publikováno v:
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).
Gang bonding process using TCB (thermo-compression bonder) has been developed in recent years as one of the methods to mount advanced packages fast [1, 2]. In the gang bonding process, we can improve the throughput considerably by post-bonding multi
Autor:
Mikio Kawakami, Yoshihito Mizutani, Hikaru Tomita, Hashimoto Yasunori, Imai Koichi, Masafumi Senda, Katsumi Terada, Toshiyuki Jinda, Noboru Asahi
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
For improvement of the productivity and the cost reduction, FOWLP (fan-out wafer level package) or FOPLP (fan-out panel level package) process using large-sized substrate has been actively developed in recent years. Above all, we will report about th
Autor:
Masafumi Senda, Mikio Kawakami, Hashimoto Yasunori, Hikaru Tomita, Toshiyuki Jinda, Noboru Asahi, Katsumi Terada, Yoshihito Mizutani, Imai Koichi
Publikováno v:
2017 International Conference on Electronics Packaging (ICEP).
As one of the methods to stack the 3D-IC fast, the collective bonding process using TCB (thermo-compression bonder) attracts attention [1-3]. In the collective bonding process, we can improve the throughput considerably by postbonding the multilayere
Autor:
Masao Tomikawa, Noboru Asahi, Yoichi Shinba, Yoshitaka Hara, Tsukuru Mizuguchi, Toshihisa Nonaka
Publikováno v:
Journal of Photopolymer Science and Technology. 21:113-117
Photo definable high dielectric constant organic-inorganic hybrid material has been developed. BaTiO3 submicron particles were heavily loaded as much as 87 vol% to photo sensitive polyimide. Patternability of line / space 20 /20 μm were demonstrated
Publikováno v:
3DIC
The evaluation result of 4 layer stacked IC which was bonded using thermal compression bonder (TCB) is reported. The throughput can be remarkably improved because chips of multi-layer can be pre bonded by using non-conductive film (NCF) which is pre-
Autor:
Yoshinori Miyamoto, Toshihisa Nonaka, Masatsugu Nimura, Hiroyuki Niwa, Koichi Fujimaru, Yoshiyuki Arai, Toshifumi Takegami, Yuta Kobayashi, Noboru Asahi, Shoichi Niizeki
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
High through put thermal compression NCF bonding was studied and the new process consisting of dividing pre and main bonding, and the multi die gang main bonding has been developed. The dividing could change the process from serial to parallel and en
Publikováno v:
Analog Integrated Circuits and Signal Processing. 25:41-49
Analog computation is a processing method that solves a given problem by utilizing an analogy of a physical system to the problem. An idea is presented here for relating the behavior of single-electron circuits to analog computation. As an instance,
Publikováno v:
IEEE Transactions on Electron Devices. 44:1109-1116
The unit device consists of four tunnel junctions and operates as a two-way switch for single-electron transport. Any combinational logic can be implemented by connecting identical unit devices into a cascade to build the tree of a BDD graph. Several
Publikováno v:
IEEJ Transactions on Electronics, Information and Systems. 117:1134-1139