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pro vyhledávání: '"Niu, Sufeng"'
Autor:
Gottipati, Sai Krishna, Sattarov, Boris, Niu, Sufeng, Pathak, Yashaswi, Wei, Haoran, Liu, Shengchao, Thomas, Karam M. J., Blackburn, Simon, Coley, Connor W., Tang, Jian, Chandar, Sarath, Bengio, Yoshua
Over the last decade, there has been significant progress in the field of machine learning for de novo drug design, particularly in deep generative models. However, current generative approaches exhibit a significant challenge as they do not ensure t
Externí odkaz:
http://arxiv.org/abs/2004.12485
We present a novel graph-neural-network-based system to effectively represent large-scale 3D point clouds with the applications to autonomous driving. Many previous works studied the representations of 3D point clouds based on two approaches, voxeliz
Externí odkaz:
http://arxiv.org/abs/1906.11359
Autor:
Niu, Sufeng, Chen, Siheng, Guo, Hanyu, Targonski, Colin, Smith, Melissa C., Kovačević, Jelena
In this paper, we introduce a generalized value iteration network (GVIN), which is an end-to-end neural network planning module. GVIN emulates the value iteration algorithm by using a novel graph convolution operator, which enables GVIN to learn and
Externí odkaz:
http://arxiv.org/abs/1706.02416
What is the best way to describe a user in a social network with just a few numbers? Mathematically, this is equivalent to assigning a vector representation to each node in a graph, a process called graph embedding. We propose a novel framework, GEM-
Externí odkaz:
http://arxiv.org/abs/1702.05764
Akademický článek
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Autor:
Niu, Sufeng, Yang, Guangyu, Sarma, Nilim, Xuan, Pengfei, Smith, Melissa C., Srimani, Pradip, Luo, Feng
Publikováno v:
2014 IEEE International Conference on Big Data (Big Data); 2014, p692-700, 9p
Publikováno v:
2013 IEEE 56th International Midwest Symposium on Circuits & Systems (MWSCAS); 2013, p117-120, 4p
Publikováno v:
2013 IEEE International Instrumentation & Measurement Technology Conference (I2MTC); 2013, p1717-1720, 4p
Publikováno v:
2013 IEEE International Instrumentation & Measurement Technology Conference (I2MTC); 2013, p1662-1665, 4p
Publikováno v:
2012 IEEE 55th International Midwest Symposium on Circuits & Systems (MWSCAS); 1/ 1/2012, p470-473, 4p