Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Nitish Natu"'
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 5:1669-1678
The 3-D integrated circuits (3-D ICs) overcome the bottlenecks in system performance and circuit density. However, their increased power and thermal density cause temperature gradients in the chip that significantly affect signal and power integrity.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2f3790e10ed1a2ed90b0e86ad01d2086
https://doi.org/10.1109/tcpmt.2015.2482947
https://doi.org/10.1109/tcpmt.2015.2482947
Autor:
Sung Joo Park, Nitish Natu, Woonghwan Ryu, Sang Min Lee, Kee Sup Kim, Byung-Hyun Lee, Madhavan Swaminathan
Publikováno v:
2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems.
Clock Distribution Networks (CDN) in three dimensional ICs face problems due to temperature and gradients observed across the die. The propagation delay of paths in the CDN varies and leads to mismatch in skew at the distribution points. This could p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::11168211fa531b63aac8c129e649a1c3
https://doi.org/10.1109/epeps.2014.7103613
https://doi.org/10.1109/epeps.2014.7103613
Autor:
Byung-Hyun Lee, Sung Joo Park, Sang Min Lee, Nitish Natu, Kee Sup Kim, Woonghwan Ryu, Madhavan Swaminathan
Publikováno v:
2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems.
Three-dimensional Integrated Circuits provide a solution to overcome bottlenecks in performance and power management issues. However, the drawback arises in the form of increased thermal density that results in thermal gradients that affect signal in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6cb266b9d876387da44e2ff3e95927b4
https://doi.org/10.1109/epeps.2013.6703469
https://doi.org/10.1109/epeps.2013.6703469