Zobrazeno 1 - 10
of 25
pro vyhledávání: '"Nishant Lakhera"'
Publikováno v:
AIMS Materials Science, Vol 5, Iss 2, Pp 301-319 (2018)
Poly(para-phenylene) (PPP) is one of the strongest and stiffest thermoplastic polymers due to its aromatic backbone structure. However, because of this chemistry, this also means that typical processing techniques require high temperatures and pressu
Externí odkaz:
https://doaj.org/article/9399431032164d789c5bf3e32d06fdca
Publikováno v:
IMAPSource Proceedings. 2022
In the world of electronic materials, solder is a critical material that plays an important role in the first level (silicon to package substrate) and second level (package to printed circuit board) interconnection. As a joining material in electroni
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e5aaec5c0aa32abd671f374d4d1070ef
https://doi.org/10.4071/001c.74741
https://doi.org/10.4071/001c.74741
Publikováno v:
IMAPSource Proceedings. 2022
Automobiles have witnessed rapid proliferation of infotainment, driver assistance and autonomous driving features which have led to significant increase in semiconductor content per car. However, this has also required increased integration of device
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ba7f6b1d5d2d8d1cb21d7ae004d845f2
https://doi.org/10.4071/001c.74750
https://doi.org/10.4071/001c.74750
Publikováno v:
Journal of Surface Mount Technology. 35:7-14
Wafer-Level Chip Scale Packages (WLCSPs) are becoming commonplace in the industry due to their small form factor. Applications include industrial and automotive which demand high reliability performance. Additionally, WLCSPs may be superior in some i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8c317e88a272ba8e0f1118db1469ca2b
https://doi.org/10.37665/smt.v35i1.19
https://doi.org/10.37665/smt.v35i1.19
Publikováno v:
International Symposium on Microelectronics. 2017:000685-000688
Encapsulation materials (e.g. mold compounds) are inherently designed to have very high resistivity (volume resistivity of > 1013 Ohm.cm) to avoid any current leakage or shorting of pins. However, multiple ingredients in mold compound, if processed i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6ba8e9f94ab584e1a32e4087c9c59339
https://doi.org/10.4071/isom-2017-thp12_012
https://doi.org/10.4071/isom-2017-thp12_012
Publikováno v:
International Symposium on Microelectronics. 2017:000304-000311
Delamination at the mold compound and leadframe interface is the most common failure mode observed during processing and qualification of the microelectronic package. Mold compound to leadframe delamination is typically observed after environmental r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a9f93280dc1343b682ea9b8307298f2f
https://doi.org/10.4071/isom-2017-wa53_009
https://doi.org/10.4071/isom-2017-wa53_009
Publikováno v:
2019 International Wafer Level Packaging Conference (IWLPC).
Over the last few years fan out wafer level packages (FOWLP) have gained significant traction and industry acceptance in product applications that have small form factor requirements. There are different FOWLP flavors that are in high volume producti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f528c83b064590baceecfd68102e0ba3
https://doi.org/10.23919/iwlpc.2019.8914130
https://doi.org/10.23919/iwlpc.2019.8914130
Publikováno v:
International Symposium on Microelectronics. 2016:000234-000239
Thick aluminum (Al) wedge bonds have been widely used in analog microelectronic packages due their lower cost, ease of use and excellent thermal and electrical performance. Reliability of thick Al wedge bonds on bare copper (Cu) leadframes under high
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::95d0bd15197de244e22a57cfb6f79327
https://doi.org/10.4071/isom-2016-wa54
https://doi.org/10.4071/isom-2016-wa54
Publikováno v:
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
This paper presents a method to predict the copper-pillar solder bump fatigue in a flip-chip device under accelerated stress testing (automotive grade) involving multi-physics via commercially available FE platform. Comparative analysis between air-t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::91344f7a8dd509fe00d0aff943e47e40
https://doi.org/10.1109/itherm.2018.8419550
https://doi.org/10.1109/itherm.2018.8419550
Publikováno v:
International Symposium on Microelectronics. 2015:000696-000701
Scanning acoustic microscopy (SAM) is the primary method to non-destructively detect internal defects in finished semiconductor packages. SAM is heavily used to detect interfacial delamination in the die-package system. Though this method can achieve
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f7ded4992c0976836cdbf9288ced99d5
https://doi.org/10.4071/isom-2015-tha61
https://doi.org/10.4071/isom-2015-tha61