Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Nishant Khanduja"'
Autor:
Chia-Ling Chen, Mehmet R. Dokmeci, Prashanth Makaram, Nishant Khanduja, Ahmed Busnaina, Xugang Xiong, Selvapraba Selvarasah
Publikováno v:
Nanotechnology. 18(39)
We present a hybrid approach that combines top-down fabrication with bottom-up directed assembly for making single-walled carbon nanotube (SWNT) based three-dimensional interconnects. The SWNTs are assembled using dielectrophoresis at room temperatur
Autor:
Shih-Hsien Chao, Prashanth Makaram, Nishant Khanduja, Selvapraba Selvarasah, Ahmed Busnaina, Chia-Ling Chen, Mehmet R. Dokmeci, Xugang Xiong
Publikováno v:
2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems.
This paper reports a novel technological approach for three-dimensional (3D) assembly of gold nanoparticles with an average diameter of 52 nm using dielectrophoresis (DEP). To realize the 3D assembly, the authors have designed and fabricated a versat
Autor:
Chia-Ling Chen, Mehmet R. Dokmeci, Nishant Khanduja, Selvapraba Selvarasah, Prashanth Makaram, Ahmed Busnaina
Publikováno v:
2007 IEEE 20th International Conference on Micro Electro Mechanical Systems (MEMS).
In this paper, we report a novel technological approach for three dimensional (3D) assembly of single-walled carbon nanotubes (SWNTs) using dielectrophoresis (DEP). The two terminal resistance of the assembled SWNTs is ~545 Ohms. Encapsulation of the
Autor:
Nishant Khanduja, Chia-Ling Chen, Mehmet R. Dokmeci, Prashanth Makaram, Xugang Xiong, Selvapraba Selvarasah, Ahmed Busnaina
Publikováno v:
Applied Physics Letters. 90:083105
By using optical lithographic procedures, the authors present a micromachined platform for large scale three dimensional (3D) assembly of gold nanoparticles with diameters of ∼50nm. The gold nanoparticles are formed into 3D low resistance bridges (