Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Nirajan Kumar"'
Autor:
Ananda Kumar Sharma, Sandip Das Sanyam, Nirajan Kumar Sah, Sanjeeb Kumar Mishra, Sanjeev Bhattarai, Rakhi Nayak
Publikováno v:
Journal of Kathmandu Medical College. 9:201-206
Background: Usage of digital devices has become one's basic need. Digital eye strain is repeatedly noticed sequelae in optometry practice. Objectives: This study aims to estimate the different aspects of eye strain. Methodology: Altogether, 55 studen
Autor:
Yuichi Miyamori, Yann Civale, Dimitrios Velenis, Annemie Van Ammel, Vladimir Cherman, A. Cockburn, Youssef Travaly, Bart Swinnen, Zsolt Tkei, Virginie Gravey, Sarasvathi Thangaraju, Nirajan Kumar, Geert Van der Plas, Zhitao Cao, Augusto Redolfi, Eric Beyne, Kristof Croes
Publikováno v:
Microelectronic Engineering. 106:155-159
Barrier reliability in 3D through-Si via (TSV) Cu interconnections requires particular attention as these structures come very close to the active devices and Cu diffusion into the silicon substrate would significantly affect device performance. This
Autor:
Augusto Redolfi, Sarasvathi Thangaraju, Geert Van der Plas, Virginie Gravey, Dimitrios Velenis, Yann Civale, Nirajan Kumar, Youssef Travaly, Philippe Soussan, Kristof Croes, Vladimir Cherman, Annemie Van Ammel, A. Cockburn, Yuichi Miyamori, Bart Swinnen, Deniz Sabuncuoglu Tezcan, Paul Hendrickx, Eric Beyne, Zsolt Tokei, Zhitao Cao
Publikováno v:
2011 IEEE International Interconnect Technology Conference.
Barrier reliability in 3D Through-Si Via (TSV) Cu interconnections requires particular attention as these structures come very close to the active devices and Cu diffusion into the silicon substrate would significantly affect device performance. This