Zobrazeno 1 - 10
of 167
pro vyhledávání: '"Ning Cheng Lee"'
Publikováno v:
Journal of Advanced Joining Processes, Vol 6, Iss , Pp 100126- (2022)
Externí odkaz:
https://doaj.org/article/259d02517bdd4b67ab212cd427beccf3
Publikováno v:
International Symposium on Microelectronics. 2021:000356-000361
Development of high-temperature lead-free (HTLF) solders to replace high-lead solders for die-attachment in power device applications is driven by (1) the harmful effects of lead to human health and the environment, and (2) the demand of the improved
Autor:
Ning-Cheng Lee
Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
High Temperature Lead‐Free Bonding Materials – The Need, the Potential Candidates and the Challenges
Autor:
Ning‐Cheng Lee, Hongwen Zhang
Publikováno v:
Lead-free Soldering Process Development and Reliability
Publikováno v:
2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Publikováno v:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
VIPPO design enabled a better signal quality and speed, but it also suffered side-effect caused by this design. At VIPPO location with or without a solid-Cu-hole-fill, the coefficient of thermal expansion (CTE) typically around 17ppm/°C which is qui
Publikováno v:
International Symposium on Microelectronics. 2019:000535-000544
During the experiment, pressure-less silver sintering pastes that can sinter using a conventional reflow oven for die-attach applications were developed. This development makes it possible to produce die-attach assemblies in a continuous and high thr
Publikováno v:
International Symposium on Microelectronics. 2019:000127-000130
A series of flux systems have been developed which would result in a reduced viscosity after reflow. This enables a high viscosity, high tack flux to be used to secure components at the component placement and reflow stage, but ends up with a low vis
Methods for Preparing Graphite Sheets with Piercing Treatment to Enhance Vertical Thermal Conduction
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Graphite film was transformed into an effective TIM material by redirecting the in-plane thermal conduction into the cross-plane conduction through piercing mechanism. The piercing action deformed the graphite film into sprout shape, thus redirecting