Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Nina Dambrowsky"'
Publikováno v:
Circuit World. 38:113-123
PurposeThe purpose of this paper is to present a summary of development work made in technical centres and on the subsequent customer qualification of copper filled through holes and blind microvias.Design/methodology/approachVarious copper depositio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::68a81060c38452b4907323e3f89850ec
https://doi.org/10.1108/03056121211250632
https://doi.org/10.1108/03056121211250632
Publikováno v:
IEICE Transactions on Electronics. :2192-2197
An ultra-deep polymer cavity structure exposed using deep X-ray lithography is used as a template for metal electroforming to produce a 24-GHz cavity resonator. The metal cavity is 1.8 mm deep and has impressive structure, including extremely vertica
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cdc64f31f3e6b3763762d66c51e8ed55
https://doi.org/10.1093/ietele/e90-c.12.2192
https://doi.org/10.1093/ietele/e90-c.12.2192
Autor:
Eric Gottwald, A. Welle, Volker Piotter, Caroline Augspurger, Roman Truckenmüller, Anna M. Wobus, Karl-Friedrich Weibezahn, Brigitte Lahni, Alexandra Rolletschek, Thomas Gietzelt, Nina Dambrowsky, Oliver Wendt, Stefan Giselbrecht, Wilhelm Pfleging
Publikováno v:
Lab Chip. 7:777-785
We describe a multi-purpose platform for the three-dimensional cultivation of tissues. The device is composed of polymer chips featuring a microstructured area of 1-2 cm(2). The chip is constructed either as a grid of micro-containers measuring 120-3
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::423ce8e6d7ca7854dc23bc960c1cb5ca
https://doi.org/10.1039/b618488j
https://doi.org/10.1039/b618488j
Publikováno v:
2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Copper filling of laser drilled blind micro vias (BMV's) is now the standard production method for high density interconnects. Copper filled BMV's are used as solder bump sites for IC packaging where the filling process enables the required interconn
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d1ab2d8a324ca9faaa70792315979543
https://doi.org/10.1109/impact.2012.6420232
https://doi.org/10.1109/impact.2012.6420232
Autor:
Wolfgang Friz, Alaaedeen Abuzir, Nina Dambrowsky, Bruce Muir, Simon Bamberg, Ralf Brüning, Frank Brüning, Laura K. Perry
Publikováno v:
MRS Proceedings. 1400
Electroless (chemical) copper deposition, followed by electrolytic (galvanic) copper deposition, is used to construct electrical interconnects for electronic components on insulating substrate materials. As smooth substrates, such as glass or flexibl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::952d3b6ac562dcd154fc4e4397e56e5f
https://doi.org/10.1557/opl.2012.92
https://doi.org/10.1557/opl.2012.92
Autor:
Stefan Giselbrecht, C.A. van Blitterswijk, Roman Truckenmüller, A. Welle, K.F. Weibezahn, Eric Gottwald, Christina Trautmann, Timo Mappes, Volker Saile, Alexandra Rolletschek, Nina Dambrowsky
Publikováno v:
Lab on a chip, 8(9), 1570-1579. Royal Society of Chemistry
This paper presents a fundamentally new approach for the manufacturing and the possible applications of lab on a chip devices, mainly in the form of disposable fluidic microchips for life sciences applications. The new technology approach is based on
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::11cb743ab3d28d494774f86aae4ddf89
https://pubmed.ncbi.nlm.nih.gov/18818815
https://pubmed.ncbi.nlm.nih.gov/18818815
Autor:
Stefan Giselbrecht, Caroline Augspurger, Brigitte Lahni, Nina Dambrowsky, Roman Truckenmüller, Volker Piotter, Thomas Gietzelt, Oliver Wendt, Wilhelm Pfleging, Alex Welle, Alexandra Rolletschek, Anna M. Wobus, Karl-Friedrich Weibezahn
Publikováno v:
Lab on a Chip; May2007, Vol. 7 Issue 6, p777-785, 9p