Zobrazeno 1 - 10
of 91
pro vyhledávání: '"Nils Hoivik"'
Publikováno v:
Sensors, Vol 14, Iss 8, Pp 15458-15479 (2014)
The field of microfluidics has yet to develop practical devices that provide real clinical value. One of the main reasons for this is the difficulty in realizing low-cost, sensitive, reproducible, and portable analyte detection microfluidic systems.
Externí odkaz:
https://doaj.org/article/8cde0e0370e24d949a312c09720c6eda
Publikováno v:
Materials, Vol 6, Iss 8, Pp 3094-3107 (2013)
Carbon nanotubes (CNTs) have been directly grown onto a silicon microsystem by a local synthesis method. This method has potential for wafer-level complimentary metal-oxide-semiconductor (CMOS) transistor-compatible integration of CNTs into more comp
Externí odkaz:
https://doaj.org/article/c693f24dbdef4b998bdf5f70bd9db63c
Publikováno v:
Materials, Vol 6, Iss 8, Pp 3160-3170 (2013)
Local synthesis and direct integration of carbon nanotubes (CNTs) into microsystems is a promising method for producing CNT-based devices in a single step, low-cost, and wafer-level, CMOS/MEMS-compatible process. In this report, the structure of the
Externí odkaz:
https://doaj.org/article/1fc32a2b4130495bbed7d7328109a1ea
Autor:
Nils Hoivik, Hoang-Vu Nguyen, Nikhilendu Tiwary, Phillip Papatzacos, Knut E. Aasmundtveit, Avisek Roy
Publikováno v:
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)
Scopus-Elsevier
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC), 13-16 Sept. 2021
Scopus-Elsevier
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC), 13-16 Sept. 2021
Cu-Sn SLID is an increasingly popular bonding technique with applications in such as hermetic sealing of microbolometers. A moderate bonding pressure is necessary to compensate for the surface roughness of the electroplated layers and to break the Sn
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b35aafa8880bc866d71f000ecd8f1655
https://doi.org/10.23919/empc53418.2021.9584990
https://doi.org/10.23919/empc53418.2021.9584990
Publikováno v:
The Journal of Physical Chemistry C. 122:7877-7884
In this paper, we report photoelectrical response of gold nanocrystalline on TiO2 nanotubes (TNTs) with Au morphology ranging from nanoparticles, thin nanoring to thick nanoring. The gold nanocrystallines are loaded on the TNT by the facile magnetron
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::24a026eb404dcd668144d3204d2f7fc4
https://doi.org/10.1021/acs.jpcc.7b08608
https://doi.org/10.1021/acs.jpcc.7b08608
Publikováno v:
Nano Energy. 30:728-744
Photochemical and photoelectrochemical water splitting is both an attainable and sustainable strategy for generating environmentally friendly energy sources. One-dimensional (1-D) TiO2 nanotubes is a promising photochemical/photoelectrochemical mater
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::76ed247c46cfaf90c14478657b64f8b8
https://doi.org/10.1016/j.nanoen.2016.09.027
https://doi.org/10.1016/j.nanoen.2016.09.027
Publikováno v:
MEMS Packaging
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::352ba4b505ab4781eba26bebff0c7346
https://doi.org/10.1142/9789813229365_0001
https://doi.org/10.1142/9789813229365_0001
Autor:
Anh-Tuan Thai Nguyen, Nils Hoivik, Knut E. Aasmundtveit, Lars Hoff, Per Steinar Halvorsen, Kristin Imenes, Ole-Johannes Grymyr, Fjodors Tjulkins
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 12:171-180
Early detection of cardiac complications after heart surgery is a crucial demand in clinical surveillance facilities. The use of accelerometer devices fixated to the heart has been demonstrated as a promising method for the detection of myocardial is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::847cbd9a2c9c223ceb2b4ee1edabe439
https://doi.org/10.4071/imaps.476
https://doi.org/10.4071/imaps.476
Publikováno v:
Metallurgical and Materials Transactions A. 46:5266-5274
Wafer-level Cu-Sn SLID (Solid–Liquid Interdiffusion)-bonded devices have been evaluated at high temperature. The bonding process was performed at 553 K (280 °C) and the mechanical integrity of the bonded samples was investigated at elevated temper
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::38e03108f84646d11ef46555e0d81105
https://doi.org/10.1007/s11661-015-3068-0
https://doi.org/10.1007/s11661-015-3068-0
Publikováno v:
Metallurgical and Materials Transactions A. 46:2637-2645
Wafer-level bonding using Au-In solid liquid interdiffusion (SLID) bonding is a promising approach to enable low-temperature assembly and MEMS packaging/encapsulation. Due to the low-melting point of In, wafer-level bonding can be performed at consid
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::653a8882be8ce1be2036b22963d65ac8
https://doi.org/10.1007/s11661-015-2865-9
https://doi.org/10.1007/s11661-015-2865-9