Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Nilesh Badwe"'
Autor:
Colin V. Greene, Ganesh Subbarayan, Yifan Wu, Raiyo Aspandiar, Nilesh Badwe, John E. Blendell, Carol A. Handwerker, Sukshitha Achar Puttur Lakshminarayana, Yaohui Fan, Travis F. Dale
Publikováno v:
Journal of Electronic Materials. 50:6615-6628
Low reflow temperature solder interconnect technology based on Sn-Bi alloys is currently being considered as an alternative for Sn-Ag-Cu solder alloys to form solder interconnects at significantly lower melting temperatures than required for Sn-Ag-Cu
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Publikováno v:
Lead-free Soldering Process Development and Reliability
Autor:
M. Renavikar, Taylor Rawlings, Diglio Paul J, Paresh Daharwal, Mohit Khurana, George Hsieh, Pooya Tadayon, Nilesh Badwe, Sarah Wozny
Publikováno v:
Materialia. 18:101136
Nanocrystalline (nc) alloys, owing to their high strength, have been extensively studied over the past few years. High-temperature mechanical properties including tensile and fatigue were studied for commercially obtained nc nickel-cobalt-phosphorous
Publikováno v:
Corrosion Science. 187:109503
Electrochemical dealloying is a corrosion process in which one elemental component of an alloy is selectively dissolved often resulting in the evolution of a bicontinuous nanoporous morphology composed of ligaments and pores. When such structures for
Publikováno v:
Acta Materialia. 129:251-258
We report results of the tensile properties of nanoporous gold (NPG) as a function of the density and average ligament diameter. As-dealloyed tensile samples were thermally treated to coarsen the length scale of the NPG structure while increasing the
Publikováno v:
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
The ultimate success of low-temperature hybrid assembly in which high-Pb Sn-Ag-Cu ball grid array solder joints are assembled with a low melting temperature alloy will be determined by a range of thermodynamic, kinetic, and microstructure evolution e
Publikováno v:
Acta Materialia. 103:512-518
We present results examining the interfacial fracture toughness of Cu2O/epoxy-resin interfaces, which is an important parameter in microelectronic packaging design. Tensiometer measurements of the epoxy-resin surface energy together with contact angl
Autor:
Shubhada H. Sahasrabudhe, Scott Mokler, Owen Jin, Nilesh Badwe, Pubudu Goonetilleke, Eric Brigham, Kevin Byrd, Satish Parupalli, Sandeep B. Sane, M. Renavikar
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Intel's commitment to the environment continues with a breakthrough technology – Low Temperature Solder for Surface Mounted Devices. In this paper we will introduce the technology and its benefits to PC and electronic device manufacturers. We will
Publikováno v:
Nature Materials. 14:894-898
When metallic alloys are exposed to a corrosive environment, porous nanoscale morphologies spontaneously form that can adversely affect the mechanical integrity of engineered structures. This form of stress-corrosion cracking is responsible for the w