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pro vyhledávání: '"Nikita S. Zemliannikov"'
Autor:
Artem A. Firsov, Nikita S. Zemliannikov, Vladimir S. Sukhanov, Sergei A. Solovev, Aleksandr V. Sukhanov
Publikováno v:
2021 IEEE Conference of Russian Young Researchers in Electrical and Electronic Engineering (ElConRus).
Currently the miniaturization of finished devices is carried out through the use of the latest methods of microelectronic assembly such as PoP (package on package), SiP (system in package), 2.5D and 3D technologies, making it possible to combine vari