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Publikováno v:
International Symposium on Microelectronics. 2012:000110-000118
Pb-Free BGA solder joints are more brittle and more susceptible to interfacial fails than the leaded versions. These brittle failures typically occur if the modules are subjected to high strain rates through module handling impacts or PCB flexural st
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d9f952b9b9924fdb84fcea6c54c0fe08
https://doi.org/10.4071/isom-2012-ta42
https://doi.org/10.4071/isom-2012-ta42
