Zobrazeno 1 - 10
of 12
pro vyhledávání: '"Nikhil Lakhkar"'
Publikováno v:
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
The Wireless Telecom Industry is moving into a new age wherein remote data transmission capabilities must meet the demands of versatile mobile devices. These needs will be met by powerful new innovations such as 4G and WiMax.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::30cd46a24c3b8a7d67add8dab7406d2e
https://doi.org/10.1109/itherm.2010.5501399
https://doi.org/10.1109/itherm.2010.5501399
Publikováno v:
Volume 5: Electronics and Photonics.
Ball shear testing is typically conducted in Wafer level chip scale package (WLCSP) fabrication to estimate the strength of the solder ball attachment. Generally, the solder ball shear strength is dependent on the solder ball size, pad size, solder/p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b742014cc398375cebbc7914176cfd66
https://doi.org/10.1115/imece2009-11832
https://doi.org/10.1115/imece2009-11832
Publikováno v:
ASME 2009 InterPACK Conference, Volume 2.
In the past decade, compact components such as Chip Scale Packages and flip chips were the work horses of miniaturization. However, emerging applications are now demanding even higher packaging density. In order to fulfill this requirement, three dim
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b862556ec33bfbf7789330cd1bca5f55
https://doi.org/10.1115/interpack2009-89349
https://doi.org/10.1115/interpack2009-89349
Publikováno v:
ASME 2009 InterPACK Conference, Volume 2.
The advancement made in portable electronic systems has primarily been due to miniaturization of electronic devices. This results in an increase in power density that leads to higher temperatures and formation of hot spots. There is a temperature spe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::22a9b12f9e1117dae8a02705311265e1
https://doi.org/10.1115/interpack2009-89341
https://doi.org/10.1115/interpack2009-89341
Publikováno v:
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
Increased power density in electronics systems is limiting the ability of air cooling to provide adequate cooling for the components in the systems. Thermoelectric cooling are solid state and highly reliable devices that can be used as either refrige
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b25e7203b745bfe3b148daa237cfd68d
https://doi.org/10.1109/itherm.2008.4544360
https://doi.org/10.1109/itherm.2008.4544360
Autor:
Woo Ho Lee, Amit Patil, Harry E. Stephanou, Dereje Agonafer, Dan O. Popa, Abiodun Fasoro, Nikhil Lakhkar
Publikováno v:
ASME 2007 InterPACK Conference, Volume 1.
Micro-Opto-electro-Mechanical Systems (MOEMS), which are MEMS integrated with photonics, share the traditional challenges of MEMS packaging with the additional issues of optical interconnects and optical surface contamination. Optoelectronic systems
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0b6a33353f3eb990251467a39f0e0eed
https://doi.org/10.1115/ipack2007-33986
https://doi.org/10.1115/ipack2007-33986
Publikováno v:
ASME 2007 InterPACK Conference, Volume 1.
Lead (Pb)-free implementation for electronic assembly has created a stir in electronic packaging industry during the last five years since Europe and eastern Asian countries decided to restrict the use of lead in electronic packages. Lead (Pb) conten
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e6b59d2929f5a7d3dc2b511fa8c50dea
https://doi.org/10.1115/ipack2007-33543
https://doi.org/10.1115/ipack2007-33543
Publikováno v:
Volume 5: Electronics and Photonics.
The advancement made in portable electronic systems has primarily been due to miniaturization of electronic systems. This in turn leads to an increase in power density which leads to higher temperatures and formation of hot spots. There is a temperat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::555eb854821d4ff33063a8938877c7dd
https://doi.org/10.1115/imece2007-42927
https://doi.org/10.1115/imece2007-42927
Autor:
Roger R. Schmidt, Aalok Trivedi, Michael J. Ellsworth, Dereje Agonafer, Nikhil Lakhkar, Madhusudhan Iyengar
Publikováno v:
ASME 2007 InterPACK Conference, Volume 1.
With the continuing industry trends towards smaller, faster and higher power devices, thermal management continues to be extremely important in the development of electronics. In this era of high heat fluxes, air cooling still remains the primary coo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4f523ad5f9431b2d4ea24e77f9a34a23
https://doi.org/10.1115/ipack2007-33975
https://doi.org/10.1115/ipack2007-33975
Publikováno v:
Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology.
With the continuing industry trends towards smaller, faster and higher power devices, thermal management has become an extremely important element in the development of computer products. The primary goal of a good thermal design is to ensure that th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e47e48262dc6e2c60fcf77193ea7dcfe
https://doi.org/10.1115/imece2005-81553
https://doi.org/10.1115/imece2005-81553