Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Nicolo' Manca"'
Autor:
Douglas Lodgson, Tom Quoc Lao, YiYi Ma, Marco Del, Nicolo' Manca, Roseanne Duca, Alex Gritti, David Cheng
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
In the field of MEMS sensors, package plays a primary role since it strongly affects device behavior and performance. Depending on the application and mission profile, design and package technology need to be targeted in order to fit the best the giv
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::84d6a9f81cb2ff1232856fd97a3f9cfe
https://doi.org/10.1109/ectc32862.2020.00075
https://doi.org/10.1109/ectc32862.2020.00075
Publikováno v:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
Presence of sensor is relevant reality on all aspects of human life and based on the development of Internet of Things (IoT) in recent years the presence of sensors in our daily life is expected to continue increasing. The usability of a sensor in an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fa87c571d7acfc30f5422912490de357
https://doi.org/10.1109/eptc47984.2019.9026616
https://doi.org/10.1109/eptc47984.2019.9026616
Autor:
A. Gritti, M. Del Sarto, G. Bruno, Amedeo Maierna, A. La Malfa, Nicolo' Manca, M. E. Castagna
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
Sensor developments involving semiconductors techniques are even more becoming a typical vehicle for high-level of integration and in many cases are constituting a solid base for a dedicated category of Micro Electro Mechanical Systems (MEMS).In the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e2c819251e83878b1719f8f5179fda37
https://doi.org/10.23919/empc44848.2019.8951868
https://doi.org/10.23919/empc44848.2019.8951868
Publikováno v:
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
In the field of MEMS and sensors, package plays a primary role since it strongly affects device behavior and performance. Depending on the application and industrial domain, the design needs to be targeted toward the given requirements. The same sens
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a4dc5ab693215601b80f93d9c4d2db18
https://doi.org/10.1109/itherm.2019.8757310
https://doi.org/10.1109/itherm.2019.8757310
Publikováno v:
COMPEL - The international journal for computation and mathematics in electrical and electronic engineering. 34:1392-1403
Purpose – The purpose of this paper is to describe an electro-mechanical lumped parameters model used for the simulation of an energy harvester device. Design/methodology/approach – The model is taking into account the main features of both mecha
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::082faa053f147e0217839c37a50f753e
https://doi.org/10.1108/compel-02-2015-0047
https://doi.org/10.1108/compel-02-2015-0047
Energy harvesting allows making sensors or transmitters electrically autonomous. Several studies have been proposed but most cases lack electrical and mechanical parts integration and practical application purpose. Here, with the aim of supplying a B
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::22a666d9993009f97c5bcc5fb410c9e7
http://hdl.handle.net/11583/2674593
http://hdl.handle.net/11583/2674593
Publikováno v:
Shock & Vibration, Aircraft/Aerospace, and Energy Harvesting, Volume 9 ISBN: 9783319152325
Powering a remote wireless sensor is a challenging task if batteries are not suitable or enough capacious and their substitution is not feasible. In this project a remote wireless sensor is placed inside training shoes with the aim to collect and tra
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9d0460d6b0e74d59b61f2409c36640dd
http://hdl.handle.net/11583/2640293
http://hdl.handle.net/11583/2640293