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pro vyhledávání: '"Nicole Bouzaida"'
Autor:
Nathalie Bernard-Henriques, Jean Charbonnier, Rachid Hida, H. Feldis, Mitsutoshi Higashi, Nicole Bouzaida, Ken Miyairi, Masahiro Sunohara, Robert Cuchet, Jean-Philippe Bally, Myriam Assous, Thierry Mourier, Gilles Simon
Publikováno v:
2012 4th Electronic System-Integration Technology Conference.
As standard organic substrate packages and wire bonding are reaching their limits in term of wiring density and integration capacity, silicon interposer approach combined with 3D integration technologies opens new possibilities in advanced packaging.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4cd49fa8bd85631fce66c3affbbbfff8
https://doi.org/10.1109/estc.2012.6542156
https://doi.org/10.1109/estc.2012.6542156
