Zobrazeno 1 - 10
of 61
pro vyhledávání: '"Nicolas Nolhier"'
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility
IEEE Transactions on Electromagnetic Compatibility, 2022, 64 (5), pp.1493-1505. ⟨10.1109/TEMC.2022.3172601⟩
IEEE Transactions on Electromagnetic Compatibility, 2022, 64 (5), pp.1493-1505. ⟨10.1109/TEMC.2022.3172601⟩
International audience; The work presented in this two-part paper focuses on a prediction method of the radiated susceptibility of integrated circuit and printed circuit board from near-field scan injection, in order to anticipate risks of non-compli
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility
IEEE Transactions on Electromagnetic Compatibility, 2022, 64 (1), pp.47-57. ⟨10.1109/TEMC.2021.3106770⟩
IEEE Transactions on Electromagnetic Compatibility, Institute of Electrical and Electronics Engineers, In press, ⟨10.1109/TEMC.2021.3106770⟩
IEEE Transactions on Electromagnetic Compatibility, 2022, 64 (1), pp.47-57. ⟨10.1109/TEMC.2021.3106770⟩
IEEE Transactions on Electromagnetic Compatibility, Institute of Electrical and Electronics Engineers, In press, ⟨10.1109/TEMC.2021.3106770⟩
International audience; In order to ensure reliability of systems early in the design phase, it is becoming crucial to have models able to predict the behavior of systems exposed to ElectroStatic Discharge (ESD). This is an increasing necessity since
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5cce2538f33ce6e817a05c868dd46009
https://hal.laas.fr/hal-03408285/document
https://hal.laas.fr/hal-03408285/document
Publikováno v:
2021 JOINT IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, SIGNAL & POWER INTEGRITY, AND EMC EUROPE
2021 JOINT IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, SIGNAL & POWER INTEGRITY, AND EMC EUROPE, Jul 2021, Glasgow (virtuel), United Kingdom. ⟨10.1109/EMC/SI/PI/EMCEurope52599.2021.9559364⟩
2021 JOINT IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, SIGNAL & POWER INTEGRITY, AND EMC EUROPE, Jul 2021, Glasgow (virtuel), United Kingdom. ⟨10.1109/EMC/SI/PI/EMCEurope52599.2021.9559364⟩
International audience; This paper aims at proposing a method based on electric near-field measurement to estimate common-mode conducted emission produced by DC-DC converter along a cable harness. The method is evaluated on two case studies: an acade
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::37a25bcc89749017f6ff7843b5c5c0f3
https://hal.laas.fr/hal-03321009
https://hal.laas.fr/hal-03321009
Publikováno v:
Microelectronics Reliability. 55:2276-2283
Reliability of embedded electronic products is a challenging issue regarding ElectroStatic Discharge (ESD) events into real live applications. This is strongly related to the increased number of embedded systems and to technologies shrinking that res
Failures caused by electrostatic discharges (ESD) constitute a major problem concerning the reliability and robustness of integrated circuits and electronic systems. This book summarizes the many diverse methodologies aimed at ESD protection and show
Publikováno v:
2017 International Symposium on Electromagnetic Compatibility (EMC EUROPE)
2017 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Sep 2017, Angers, France. ⟨10.1109/EMCEurope.2017.8094675⟩
2017 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Sep 2017, Angers, France. ⟨10.1109/EMCEurope.2017.8094675⟩
International audience; An automotive application can see several perturbations during his life. In this paper we study how the LIN communication under ESD stress behaves and what sort of failures could be observed. We proposed a characterisation met
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::293b01753a5d9e41e815d587706ec6ef
https://hal.laas.fr/hal-01698505/document
https://hal.laas.fr/hal-01698505/document
Publikováno v:
Microelectronics Reliability
Microelectronics Reliability, Elsevier, 2017, 76-77, pp.685-691. ⟨10.1016/j.microrel.2017.07.032⟩
Microelectronics Reliability, 2017, 76-77, pp.685-691. ⟨10.1016/j.microrel.2017.07.032⟩
Microelectronics Reliability, Elsevier, 2017, 76-77, pp.685-691. ⟨10.1016/j.microrel.2017.07.032⟩
Microelectronics Reliability, 2017, 76-77, pp.685-691. ⟨10.1016/j.microrel.2017.07.032⟩
International audience; During its life, an automotive application can encounter several perturbations such as fast transient of ESD discharges. In this paper, we propose a LIN transceiver behavior model to predict both hard and soft failures within
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::89c0c3535644debd036d1095683774bc
https://hal.laas.fr/hal-01698397/document
https://hal.laas.fr/hal-01698397/document
In this chapter, we describe several case studies that have been analyzed at LAAS-CNRS within the context of PhD theses and with our industrial partners. These concern both integrated circuits and electronic systems on boards.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ae7236216adb5dd332de06241a543d15
https://doi.org/10.1016/b978-1-78548-122-2.50005-4
https://doi.org/10.1016/b978-1-78548-122-2.50005-4
In this chapter, we look at the different ESD standards that are used for qualifying integrated circuits (ICs) and electronic systems. At the component level, these standards provide a guarantee that the IC is able to survive the various steps of ass
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::68e3ff221a00d92ec3d543f8cbfabc20
https://doi.org/10.1016/b978-1-78548-122-2.50001-7
https://doi.org/10.1016/b978-1-78548-122-2.50001-7