Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding

Autor: Simon J. Bleiker, Maaike M. Visser Taklo, Nicolas Lietaer, Andreas Vogl, Thor Bakke, Frank Niklaus

Publikováno v: Micromachines, Vol 7, Iss 10, p 192 (2016)

Device encapsulation and packaging often constitutes a substantial part of the fabrication cost of micro electro-mechanical systems (MEMS) transducers and imaging sensor devices. In this paper, we propose a simple and cost-effective wafer-level cappi

Externí odkaz: https://doaj.org/article/7c1cdf4d913b45a2a6cdd64ad6639870

Characterisation of thermocompression bonds formed using metal coated polymer core particles for fine pitch interconnections

Autor: David C. Whalley, Mark W. Sugden, David A. Hutt, Changqing Liu, Nicolas Lietaer, Junlei Tao

Publikováno v: 2016 6th Electronic System-Integration Technology Conference (ESTC).

Metalized micron scale polymer particles have been utilised in anisotropically conductive adhesives for a number of years and more recent work has investigated their selective deposition to provide interconnects. In this work such particles have succ

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::c2f577e235d5b7d4736e802ccd46f056
https://doi.org/10.1109/estc.2016.7764690

(Invited) 3D Interconnect Technologies for Advanced MEMS/NEMS Applications

Autor: Nicolas Lietaer, Maaike M. Visser Taklo, Peter Ramm, Kari Schjølberg-Henriksen

Publikováno v: ECS Transactions

3D integration and wafer level packaging (WLP) with through-silicon vias offer benefits like reduced footprint and improved performance. CMOS imaging sensors is one of the first successful introductions of a product with TSVs on the market, and 3D in

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::cf4ea315dcb91e12c52a46ff188c6477
https://doi.org/10.1149/1.3390661

Dry-film resist technology for versatile TSV fabrication for MEMS, tested on blind dummy TSVs

Autor: Nicolas Lietaer, Anand Summanwar, Leny Nazareno, Sara Rund Herum

Publikováno v: 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP).

Three-dimensional (3D) integration of MEMS and ICs enables improvements in device performance, and often requires through-silicon vias (TSVs). TSV technologies presently available for micro electromechanical systems (MEMS) either have completely fill

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::ebb8f75dad7e34b2324571b35ff06b2d
https://doi.org/10.1109/dtip.2014.7056631

3D-FBK pixel sensors:Recent beam tests results with irradiated devices

Autor: C. Butter, Stephen Watts, Andrea Cristofoli, Jasmine Hasi, Karl Jakobs, Markus Konrad Köhler, Marcella Capua, Juha Kalliopuska, Pierpaolo Palestri, M. L. Kocian, Sebastian Grinstein, P. Hansson, Steinar Stapnes, J. Freestone, A. Micelli, C. J. S. Young, C. H. Lai, Anna Mastroberardino, Hans Krüger, Sherwood Parker, Shaun Roe, MarioPaolo Giordani, Paolo Gabos, E. Bolle, Daniel Dobos, A. Rovani, Fabian Hügging, Thor Erik Hansen, C. Pradilla, Robert Thompson, C.J. Kenney, K. N. Sjoebaek, Thor-Erik Hansen, Giovanni Darbo, Marina Cobal, Luca Selmi, Giulio Pellegrini, H. Davetak, Claudio Piemonte, Maurizio Boscardin, S. Fazio, Joleen Pater, Vadim Kostyukhin, Claudia Gemme, Manuel Lozano, Matteo Cavalli-Sforza, Martin Hoeferkamp, S. D. Kolya, Maurice Garcia-Sciveres, Clara Nellist, C. Da Via, Richard Bates, Ole Røhne, K. Helle, Paul Jackson, Jieh-Wen Tsung, Val O'Shea, P. Grenier, G. Gariano, Norbert Wermes, C. Fleta, M. Borri, Nicola Zorzi, C. Gallrapp, A. La Rosa, Stanislav Pospisil, B. Stugu, Giancarlo Susinno, Sally Seidel, B. DeWilde, Dong Su, H. Gjersdal, David Esseni, Tomas Slavicek, Heidi Sandaker, Marco Barbero, Kevin Einsweiler, D. Silverstein, E. Ruscino, M. Povoli, Sabina Ronchin, G.-F. Dalla Betta, Alvise Bagolini, Aarne Oja, U. Parzefall, B. Di Girolamo, M. Karagounis, Nicolas Lietaer, Angela Kok, Dmitri Tsybychev, Heinz Pernegger, I. Korokolov

Publikováno v: Micelli, A, Helle, K, Sandaker, H, Stugu, B, Barbero, M, Hügging, F, Karagounis, M, Kostyukhin, V, Krüger, H, Tsung, J W, Wermes, N, Capua, M, Fazio, S, Mastroberardino, A, Susinno, G, Gallrapp, C, Di Girolamo, B, Dobos, D, La Rosa, A, Pernegger, H, Roe, S, Slavicek, T, Pospisil, S, Jakobs, K, Köhler, M, Parzefall, U, Darbo, G, Gariano, G, Gemme, C, Rovani, A, Ruscino, E, Butter, C, Bates, R, Oshea, V, Parker, S, Cavalli-Sforza, M, Grinstein, S, Korokolov, I, Pradilla, C, Einsweiler, K, Garcia-Sciveres, M, Borri, M, Da Vià, C, Freestone, J, Kolya, S, Lai, C H, Nellist, C, Pater, J, Thompson, R, Watts, S J, Hoeferkamp, M, Seidel, S, Bolle, E, Gjersdal, H, Sjoebaek, K N, Stapnes, S, Rohne, O, Su, D, Young, C, Hansson, P, Grenier, P, Hasi, J, Kenney, C, Kocian, M, Jackson, P, Silverstein, D, Davetak, H, Dewilde, B, Tsybychev, D, Dalla Betta, G F, Gabos, P, Povoli, M, Cobal, M, Giordani, M P, Selmi, L, Cristofoli, A, Esseni, D, Palestri, P, Fleta, C, Lozano, M, Pellegrini, G, Boscardin, M, Bagolini, A, Piemonte, C, Ronchin, S, Zorzi, N, Hansen, T E, Hansen, T, Kok, A, Lietaer, N, Kalliopuska, J & Oja, A 2011, ' 3D-FBK pixel sensors : Recent beam tests results with irradiated devices ', Nuclear Instruments and Methods in Physics Research. Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, vol. 650, no. 1, pp. 150-157 . https://doi.org/10.1016/j.nima.2010.12.209

The Pixel Detector is the innermost part of the ATLAS experiment tracking device at the Large Hadron Collider, and plays a key role in the reconstruction of the primary vertices from the collisions and secondary vertices produced by short-lived parti

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d70bc454bf32ec27eb9c342b9a0022fb
https://cris.vtt.fi/en/publications/6a898f0b-f813-4670-b2d0-94bf37e2d3f2