Zobrazeno 1 - 1
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pro vyhledávání: '"Nicolas E. Pizzuti"'
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Resin cracking is a common failure mechanism in electronic packaging using organic chip carrier. Chip carrier made of organic material has been industry standard for the past decade as they provide significant advantages over the ceramic dielectric-b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1dee62ed5abd7b3b10f520818c719962
https://doi.org/10.1109/ectc.2017.259
https://doi.org/10.1109/ectc.2017.259
