Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Nicolas Dube"'
Publikováno v:
IEEE Internet Computing. 25:26-34
Driven by convergence with artificial intelligence and data analytics, increased heterogeneity, and a hybrid cloud/on-premise delivery model, dynamic composition of workflows will be a key design criteria of future high-performance computing (HPC) sy
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a40b8030a4a44b27245f85980d67c335
https://doi.org/10.1109/mic.2021.3103236
https://doi.org/10.1109/mic.2021.3103236
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:883-891
In this work, we investigated the effect of pitch distance on the statistical variation and morphology of extrusion in Cu through-silicon vias (TSVs) and the underlying mechanisms. Extrusion statistics were obtained from TSV samples with two differen
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d1c8c0ac243b89193bacf800e0177504
https://doi.org/10.1109/tcpmt.2021.3078772
https://doi.org/10.1109/tcpmt.2021.3078772
Publikováno v:
DATE
After the end of Dennard scaling and with the imminent end of Moore's Law, it has become challenging to continue scaling HPC systems within a given power envelope. This is exacerbated most in large systems, such as high end supercomputers. To allevia
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::24b6fd75c8d196e0336e41f33ab1fe0c
https://doi.org/10.23919/date51398.2021.9474063
https://doi.org/10.23919/date51398.2021.9474063
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
In this work, we investigated the effect of pitch distance on the statistical variation of Cu protrusion in TSVs and its underlying mechanisms. The magnitude and statistical spread of Cu protrusion in 120 vias from two TSV arrangements with pitch dis
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4e36952a097a87f1fbdb509133288cff
https://doi.org/10.1109/ectc32862.2020.00188
https://doi.org/10.1109/ectc32862.2020.00188
Autor:
Nic McDonald, Satoshi Matsuoka, Jens Domke, Tomoya Yuki, Akihiro Nomura, Ivan Radanov, Yuki Tsushima, Dennis L. Floyd, Nicolas Dube, Shin'ichi Miura
Publikováno v:
Hot Interconnects
The state-of-the-art topology for modern supercomputers are Folded Clos networks, a.k.a. Fat-Trees. The node count in these massively parallel systems is steadily increasing. This forces an increased path length, which limits gains for latency-sensit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7fe8de8eac2272b30a5ff246dba6dda1
https://doi.org/10.1109/hoti.2019.00013
https://doi.org/10.1109/hoti.2019.00013
Autor:
Nicolas Dube
Publikováno v:
SC Companion
This presentation debunks three "truths" as seen from Plato's cave: the untold story of PUE, clean coal, and water is free and available.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7e621f33cf20862ad144507a51ccc510
https://doi.org/10.1109/sc.companion.2012.124
https://doi.org/10.1109/sc.companion.2012.124
Autor:
Nicolas Dube
Publikováno v:
Proceedings of the 2011 workshop on Energy Efficiency: HPC System and Datacenters.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8561b739bddd64af9cccfa5030c7142a
https://doi.org/10.1145/2159344.2159351
https://doi.org/10.1145/2159344.2159351