Zobrazeno 1 - 10
of 80
pro vyhledávání: '"Nick Ross"'
Publikováno v:
Sushruta Journal of Health Policy & Opinion. 15:1-8
Workplace bullying, undermining and microaggressions are a reality for many, and although the prevalence may vary, there is no environment that is free of such hostile interactions. The healthcare workforce is focussed on empathy, kindness and caring
Autor:
Nick Ross
Publikováno v:
British Journal of Psychiatry. 212:265-268
Broadcaster and journalist. FRCP (hon)
Autor:
Muthappan Asokan, John Alptekin, Nick Ross, Ashish Salunke, Joshua Caperton, Goutham Issac Ashok Kumar, Oliver Chyan
Publikováno v:
Microelectronics Reliability. 113:113917
Microelectronic reliability requirements are tightening to a standard of near zero ppb defects due to the evolution of self-driving cars and wearable electronics. The successful transition from gold (Au) to copper (Cu) in wire-bonding introduces corr
Autor:
Nick Ross
Publikováno v:
BMJ (Clinical research ed.). 360
The following is a letter of 5 February 2018 to the chair of the General Medical Council. Dear Professor Stephenson, My last letter to you about Hadiza Bawa-Garba (9 November 2017)1 was followed by a stream of similar comments in the medical and nati
Publikováno v:
Supportive Care in Cancer. 28:963-964
Autor:
L. Nguyen, S. Berhe, Nick Ross, S. O. Connor, A. Lambert, M. Chowdhury, Oliver Chyan, Muthappan Asokan
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Heavy corrosion on Aluminum (Al) bond pad, with a "mud-crack" appearance, in a Copper (Cu) wire-bonded assembly can be a critical failure mode, especially under harsh conditions such as in automotive environments. Such corrosion can be associated wit
Publikováno v:
ECS Meeting Abstracts. :977-977
The explosion of microelectronics use in automobiles has made the microelectronic corrosion control more critical over the past decade. Wire bonded devices form an integral part of the microelectronic systems used in automobiles. With the reliability
Publikováno v:
MRS Proceedings. 1536:127-132
In this study, we employed Multiple Internal Reflection Infrared Spectroscopy (MIR-IR) to characterize chemical bonding structures of boron doped hydrogenated amorphous silicon (a-Si:H(B)). This technique has been shown to provide over a hundred fold
Publikováno v:
ECS Transactions. 41:315-322
The introduction of porous ultralow-k (ULK) dielectrics into Cu metal interconnect continues to pose major BEP integration difficulties beyond 32 nm. As stated in the2009 ITRS Roadmap, “Etching and ashing processes are among the worst processes for
Publikováno v:
JAMA Internal Medicine. 178:1142