Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Nicholas Lay"'
Publikováno v:
IMAPSource Proceedings. 2022
Increased performance and smaller form factor have driven demand for next generation architectures for integrated circuit 3D (IC) chip packaging. Advanced chip packaging technologies, such as 2.5D and 3D, offer greater chip compatibility and lower po
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::35ce7346d7446cea45cf8ff0fe0c484c
https://doi.org/10.4071/001c.74770
https://doi.org/10.4071/001c.74770
Autor:
El Tayeb Bentria, Prathamesh Mahesh Shenai, Stefano Sanvito, Heesoo Park, Laurent Karim Béland, Nicholas Laycock, Fedwa El Mellouhi
Publikováno v:
npj Materials Degradation, Vol 8, Iss 1, Pp 1-8 (2024)
Abstract Iron pentacarbonyl (IPC) gas forms upon the reaction of carbon monoxide with Fe containing metallic surfaces under gas reforming conditions. IPC formation can sometimes reach alarming levels that cause metal loss, pipeline thinning corrosion
Externí odkaz:
https://doaj.org/article/e48c172807d2430c8721229d2787d3c5
Autor:
Aarthi Thyagarajan, Wouter Hamer, Joy Phophichitra, Valliappan Valliappan, Abitha Ramesh, Prathamesh Shenai, Nicholas Laycock
Publikováno v:
Corrosion and Materials Degradation, Vol 2, Iss 4, Pp 762-769 (2021)
The conventional corrosion management process consists of defining the expected process conditions, identifying potential corrosion threats, and estimating their likely rate, then using that information to develop mitigation plans and inspection sche
Externí odkaz:
https://doaj.org/article/931a8d0ef85840108b1d8bc12ed6f5b6