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pro vyhledávání: '"Nicholas H. Tripsas"'
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 96:48-51
The mechanism responsible for charging damage to integrated circuit device insulators is treated as a plasma phenomenon, in which the beam/plasma drives potential differences on the process surface. J−V data obtained with the CHARM2 diagnostic in a
Autor:
Nicholas H. Tripsas, R. Johnson
Publikováno v:
Proceedings of 11th International Conference on Ion Implantation Technology.
Process qualifications are required as new equipment is added to a fab to ensure good product quality. For Ion Implanters, dose-matching of machines is a necessary first step in this procedure. Split-lot qualifications are also commonly run prior to
Autor:
Nicholas H. Tripsas
Publikováno v:
Proceedings of 11th International Conference on Ion Implantation Technology.
Equipment matching is a major consideration for process transfers between fab areas. When process transfers occur between fabs with similar equipment, simple dose matching is often adequate. However, it is not enough in the ease where transfers occur
Publikováno v:
Proceedings of 11th International Conference on Ion Implantation Technology.
Wafer charging effects in an Applied Materials 9500 implanter were studied for high current As and BF2 implants with EEPROM-based sense and measurement devices (CHARM(R)-2) and transistor structures (SPIDER). The operational modes of the implanter we
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Conference
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