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pro vyhledávání: '"Nicholas A. Boynton"'
Autor:
Nicholas A. Boynton, Forrest G. Valdez, Thomas A. Friedmann, Shawn C. Arterburn, Christina M. Dallo, Andrew T. Pomerene, Andrew L. Starbuck, Douglas C. Trotter, Michael R. Gehl, Christopher T. DeRose, Shayan Mookherjea, Anthony L. Lentine
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:1729-1739
Autor:
Steven J. Sibener, Neil D. Dolinski, Julia G. Murphy, Katie M. Herbert, Nicholas R. Boynton, Stuart J. Rowan, Charlie A. Lindberg
Publikováno v:
ACS applied materialsinterfaces. 13(23)
A series of multistage (pressure-sensitive/hot melt) adhesives utilizing dynamic thia-Michael bonding motifs are reported. The benzalcyanoacetate Michael acceptors used in this work undergo bond exchange under ambient conditions without external cata