Zobrazeno 1 - 10
of 314
pro vyhledávání: '"Nian Cai"'
Publikováno v:
Micromachines, Vol 15, Iss 4, p 428 (2024)
Based on the theory of reliability enhancement testing technology, this study used a variety of testing combinations and finite element simulations to analyze the stress–strain properties of 3D packaging storage modules and then evaluated its opera
Externí odkaz:
https://doaj.org/article/b04ad734b2574e76b82d8f7961665a32
Publikováno v:
Micromachines, Vol 15, Iss 3, p 418 (2024)
With the advancement of micro- and nanomanufacturing technologies, electronic components and chips are increasingly being miniaturized. To automatically identify their packaging materials for ensuring the reliability of ICs, a hybrid deep learning fr
Externí odkaz:
https://doaj.org/article/639ac1c2f5ad4e5b976e0bd23ab5092d
Autor:
Yinghong Zhou, Zhiliang Wu, Nian Cai, Daohua Zhan, Shaoqiu Xu, Meiyun Chen, Guang Zhou, Han Wang
Publikováno v:
Micromachines, Vol 14, Iss 8, p 1555 (2023)
To automatically measure the surface profile of a cylindrical workpiece, a high-precision multi-beam optical method is proposed in this paper. First, some successive images for the cylindrical workpiece’s surface are acquired by a multi-beam angle
Externí odkaz:
https://doaj.org/article/7ef2216456154e629267e0663779ec14
Autor:
Renbin Huang, Daohua Zhan, Xiuding Yang, Bei Zhou, Linjun Tang, Nian Cai, Han Wang, Baojun Qiu
Publikováno v:
Micromachines, Vol 14, Iss 7, p 1375 (2023)
In order to improve the production quality and qualification rate of chips, X-ray nondestructive imaging technology has been widely used in the detection of chip defects, which represents an important part of the quality inspection of products after
Externí odkaz:
https://doaj.org/article/d9470ae273bf4b61a24f4d1ef73e23be
Autor:
Daohua Zhan, Jian Lin, Xiuding Yang, Renbin Huang, Kunran Yi, Maoling Liu, Hehui Zheng, Jingang Xiong, Nian Cai, Han Wang, Baojun Qiu
Publikováno v:
Micromachines, Vol 14, Iss 6, p 1119 (2023)
Integrated circuit (IC) X-ray wire bonding image inspections are crucial for ensuring the quality of packaged products. However, detecting defects in IC chips can be challenging due to the slow defect detection speed and the high energy consumption o
Externí odkaz:
https://doaj.org/article/d4e3da056f274ce6bd9ef9f699a893d4
Autor:
Guojie Xu, Bei Zhou, Jian Guo, Jun Zeng, Rongguang Zhang, Nian Cai, Yongxing Li, Peixuan Wu, Xun Chen, Han Wang, Juan M. Ruso, Zhen Liu
Publikováno v:
Micromachines, Vol 13, Iss 9, p 1378 (2022)
The centrifugal electrostatic blowing process proposed in this paper solves the difficult continuous and stable deposition problem in the traditional centrifugal electrostatic spinning process. By establishing a flight deposition model of the centrif
Externí odkaz:
https://doaj.org/article/49c0cd1acac9408d8b07f02d03f4c191
Autor:
Jiarong Zhang, Han Wang, Xiangyou Zhu, Honghui Yao, Shaomu Zhuo, Shuaijie Ma, Daohua Zhan, Nian Cai
Publikováno v:
Materials, Vol 15, Iss 14, p 4848 (2022)
For small aspherical molds, it is difficult for the existing polishing method to take into account the correction of the surface error and the control of the uniformity of the surface roughness (SR) distribution, because the polishing tool is always
Externí odkaz:
https://doaj.org/article/fbeee0cf01a74436a6f8efb066585d1f
Publikováno v:
IEEE Access, Vol 7, Pp 148645-148657 (2019)
Automatically segmenting bile ducts and hepatolith in abdominal CT scans is helpful to assist hepatobiliary surgeons for minimally invasive surgery. High-deformation characteristics of bile ducts and small-size characteristics of hepatolith make this
Externí odkaz:
https://doaj.org/article/428029478d7c480aa674b02c004b38ee
Autor:
Feiyu Fang, Han Wang, Huaquan Wang, Wei Min Huang, Yahui Chen, Nian Cai, Xindu Chen, Xin Chen
Publikováno v:
Micromachines, Vol 12, Iss 8, p 920 (2021)
Shrinkage is observed in many electrospun membranes. The stretched conformation of the macromolecular chains has been proposed as the possible cause. However, so far, our understanding of the fundamentals is still qualitative and cannot provide much
Externí odkaz:
https://doaj.org/article/49971853d4f44e588027dd6daea9b54f
Autor:
Lixiong Huang, Han Wang, Peixuan Wu, Weimin Huang, Wei Gao, Feiyu Fang, Nian Cai, Rouxi Chen, Ziming Zhu
Publikováno v:
Sensors, Vol 20, Iss 15, p 4266 (2020)
Laser-induced graphene (LIG) has the advantages of one-step fabrication, prominent mechanical performance, as well as high conductivity; it acts as the ideal material to fabricate flexible strain sensors. In this study, a wearable flexible strain sen
Externí odkaz:
https://doaj.org/article/2aa49180e54646b388c6e212052827b8