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pro vyhledávání: '"Neyman, Elizabeth"'
Autor:
Neyman, Elizabeth
The adhesion durability of coatings and encapsulant materials utilized in electronic packaging is vital for device reliability in the microelectronics industry. Due to adverse operating conditions such as high moisture and high temperature environmen
Externí odkaz:
http://hdl.handle.net/10919/34490
http://scholar.lib.vt.edu/theses/available/etd-08122003-142916/
http://scholar.lib.vt.edu/theses/available/etd-08122003-142916/
Publikováno v:
Journal of Adhesion; Apr2006, Vol. 82 Issue 4, p331-353, 23p, 1 Diagram, 5 Charts, 7 Graphs
