Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Negishi Motohiro"'
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 21:224-233
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b5cea5b125ba6ca48cd8b233453b66d3
https://doi.org/10.5104/jiep.21.224
https://doi.org/10.5104/jiep.21.224
Autor:
Bao Ngoc An, Kawana Yuki, Helge Wurst, Suguru Ueda, Sugama Chie, Negishi Motohiro, Benjamin Leyrer, Yoshinori Ejiri, Thomas Blank, Dai Ishikawa, Hideo Nakako, Marc Weber
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
this paper describes the sintering properties and bonding properties of copper (Cu) die-bonding sinter paste for power devices operating at high temperatures. The Cu paste can be sintered pressure less in 100% H2 or under pressure in 100% N2 atmosphe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3f10e7d3404b806331e10ca864648dd2
https://doi.org/10.1109/estc.2018.8546455
https://doi.org/10.1109/estc.2018.8546455
Autor:
Negishi, Motohiro, Akada, Kentaro, Takizawa, Kaoru, Miyake, Hiroaki, Tanaka, Yasuhiro, Takada, Tatsuo
Publikováno v:
2012 IEEE International Conference on Condition Monitoring & Diagnosis; 1/ 1/2012, p122-125, 4p