Zobrazeno 1 - 10
of 80
pro vyhledávání: '"Nayeem MOG"'
Autor:
Hou JF; Media Lab, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA., Nayeem MOG; Media Lab, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA., Caplan KA; Department of Brain and Cognitive Sciences, McGovern Institute for Brain Research, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA., Ruesch EA; Department of Psychological and Brain Sciences, The Center for Systems Neuroscience, Boston University, Boston, 02215, MA, USA., Caban-Murillo A; Department of Psychological and Brain Sciences, The Center for Systems Neuroscience, Boston University, Boston, 02215, MA, USA., Criado-Hidalgo E; Division of Chemistry and Chemical Engineering, California Institute of Technology, Pasadena, CA, 91125, USA., Ornellas SB; Media Lab, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA., Williams B; Center for Systems Neuroscience, Neurophotonics Center, Department of Biomedical Engineering, Boston University, 610 Commonwealth Ave., Boston, MA, 02215, USA., Pearce AA; Department of Brain and Cognitive Sciences, McGovern Institute for Brain Research, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA., Dagdeviren HE; Department of Neurosurgery, Faculty of Medicine, Istanbul University, Istanbul, 34093, Turkey., Surets M; Department of Psychological and Brain Sciences, The Center for Systems Neuroscience, Boston University, Boston, 02215, MA, USA., White JA; Center for Systems Neuroscience, Neurophotonics Center, Department of Biomedical Engineering, Boston University, 610 Commonwealth Ave., Boston, MA, 02215, USA., Shapiro MG; Division of Chemistry and Chemical Engineering, California Institute of Technology, Pasadena, CA, 91125, USA., Wang F; Department of Brain and Cognitive Sciences, McGovern Institute for Brain Research, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA., Ramirez S; Department of Psychological and Brain Sciences, The Center for Systems Neuroscience, Boston University, Boston, 02215, MA, USA., Dagdeviren C; Media Lab, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA. canand@media.mit.edu.
Publikováno v:
Nature communications [Nat Commun] 2024 Jul 25; Vol. 15 (1), pp. 6280. Date of Electronic Publication: 2024 Jul 25.
Autor:
Hou JF; Media Lab, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA., Nayeem MOG; Media Lab, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA., Caplan KA; Department of Brain and Cognitive Sciences, McGovern Institute for Brain Research, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA., Ruesch EA; Department of Psychological and Brain Sciences, The Center for Systems Neuroscience, Boston University, Boston, 02215, MA, USA., Caban-Murillo A; Department of Psychological and Brain Sciences, The Center for Systems Neuroscience, Boston University, Boston, 02215, MA, USA., Criado-Hidalgo E; Division of Chemistry and Chemical Engineering, California Institute of Technology, Pasadena, CA, 91125, USA., Ornellas SB; Media Lab, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA., Williams B; Center for Systems Neuroscience, Neurophotonics Center, Department of Biomedical Engineering, Boston University, 610 Commonwealth Ave., Boston, MA, 02215, USA., Pearce AA; Department of Brain and Cognitive Sciences, McGovern Institute for Brain Research, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA., Dagdeviren HE; Department of Neurosurgery, Faculty of Medicine, Istanbul University, Istanbul, 34093, Turkey., Surets M; Department of Psychological and Brain Sciences, The Center for Systems Neuroscience, Boston University, Boston, 02215, MA, USA., White JA; Center for Systems Neuroscience, Neurophotonics Center, Department of Biomedical Engineering, Boston University, 610 Commonwealth Ave., Boston, MA, 02215, USA., Shapiro MG; Division of Chemistry and Chemical Engineering, California Institute of Technology, Pasadena, CA, 91125, USA., Wang F; Department of Brain and Cognitive Sciences, McGovern Institute for Brain Research, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA., Ramirez S; Department of Psychological and Brain Sciences, The Center for Systems Neuroscience, Boston University, Boston, 02215, MA, USA., Dagdeviren C; Media Lab, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA. canand@media.mit.edu.
Publikováno v:
Nature communications [Nat Commun] 2024 Jun 04; Vol. 15 (1), pp. 4601. Date of Electronic Publication: 2024 Jun 04.
Autor:
Wang W; Department of Electrical Engineering and Information Systems, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan.; Thin-Film Device Laboratory, RIKEN, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan., Harimurti S; Department of Electrical Engineering and Information Systems, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan., Inoue D; Thin-Film Device Laboratory, RIKEN, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan., Nayeem MOG; Department of Electrical Engineering and Information Systems, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan., Wang J; Department of Electrical Engineering and Information Systems, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan.; Thin-Film Device Laboratory, RIKEN, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan., Okuda C; Department of Electrical Engineering and Information Systems, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan., Hashizume D; Thin-Film Device Laboratory, RIKEN, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan., Lee S; Department of Electrical Engineering and Information Systems, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan.; Thin-Film Device Laboratory, RIKEN, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan., Fukuda K; Thin-Film Device Laboratory, RIKEN, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan., Yokota T; Department of Electrical Engineering and Information Systems, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan.; Institute of Engineering Innovation, Graduate School of Engineering, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan., Someya T; Department of Electrical Engineering and Information Systems, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan.; Thin-Film Device Laboratory, RIKEN, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan.
Publikováno v:
ACS applied materials & interfaces [ACS Appl Mater Interfaces] 2024 May 29; Vol. 16 (21), pp. 27065-27074. Date of Electronic Publication: 2024 May 15.
Autor:
Yu CC; Media Lab, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA.; Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA., Shah A; Media Lab, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA., Amiri N; Department of Mechanical and Aerospace Engineering, University at Buffalo, Buffalo, NY, 14260, USA., Marcus C; Media Lab, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA.; Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA., Nayeem MOG; Media Lab, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA., Bhayadia AK; Department of Mechanical and Aerospace Engineering, University at Buffalo, Buffalo, NY, 14260, USA., Karami A; Department of Mechanical and Aerospace Engineering, University at Buffalo, Buffalo, NY, 14260, USA., Dagdeviren C; Media Lab, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA.
Publikováno v:
Advanced materials (Deerfield Beach, Fla.) [Adv Mater] 2023 Jun; Vol. 35 (23), pp. e2300066. Date of Electronic Publication: 2023 Apr 19.
Autor:
Wang C; Department of Electrical Engineering and Information Systems, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan., Wang H; Department of Electrical Engineering and Information Systems, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan., Wang B; Department of Electrical Engineering and Information Systems, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan., Miyata H; Department of Electrical Engineering and Information Systems, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan., Wang Y; Department of Electrical Engineering and Information Systems, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan., Nayeem MOG; Department of Electrical Engineering and Information Systems, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan., Kim JJ; Department of Electrical Engineering and Information Systems, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan., Lee S; Department of Electrical Engineering and Information Systems, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan., Yokota T; Department of Electrical Engineering and Information Systems, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan., Onodera H; Department of Electrical Engineering and Information Systems, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan., Someya T; Department of Electrical Engineering and Information Systems, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan.
Publikováno v:
Science advances [Sci Adv] 2022 May 20; Vol. 8 (20), pp. eabo1396. Date of Electronic Publication: 2022 May 20.
Autor:
Zhong J; Thin-Film Device Laboratory and Center for Emergent Matter Science, RIKEN, 2-1 Hirosawa, Wako, Saitama, 351-0198, Japan.; Department of Electromechanical Engineering and Centre for Artificial Intelligence and Robotics, University of Macau, Macau, SAR, 999078, China., Li Z; Department of Electromechanical Engineering and Centre for Artificial Intelligence and Robotics, University of Macau, Macau, SAR, 999078, China., Takakuwa M; Thin-Film Device Laboratory and Center for Emergent Matter Science, RIKEN, 2-1 Hirosawa, Wako, Saitama, 351-0198, Japan.; Department of Modern Mechanical Engineering, Waseda University, 3-4-1 Okubo, Shinjuku-ku, Tokyo, 169-8555, Japan., Inoue D; Thin-Film Device Laboratory and Center for Emergent Matter Science, RIKEN, 2-1 Hirosawa, Wako, Saitama, 351-0198, Japan., Hashizume D; Thin-Film Device Laboratory and Center for Emergent Matter Science, RIKEN, 2-1 Hirosawa, Wako, Saitama, 351-0198, Japan., Jiang Z; Thin-Film Device Laboratory and Center for Emergent Matter Science, RIKEN, 2-1 Hirosawa, Wako, Saitama, 351-0198, Japan., Shi Y; Department of Electromechanical Engineering and Centre for Artificial Intelligence and Robotics, University of Macau, Macau, SAR, 999078, China., Ou L; Department of Electromechanical Engineering and Centre for Artificial Intelligence and Robotics, University of Macau, Macau, SAR, 999078, China., Nayeem MOG; Electrical and Electronic Engineering and Information Systems, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo, 113-8656, Japan., Umezu S; Department of Modern Mechanical Engineering, Waseda University, 3-4-1 Okubo, Shinjuku-ku, Tokyo, 169-8555, Japan., Fukuda K; Thin-Film Device Laboratory and Center for Emergent Matter Science, RIKEN, 2-1 Hirosawa, Wako, Saitama, 351-0198, Japan., Someya T; Thin-Film Device Laboratory and Center for Emergent Matter Science, RIKEN, 2-1 Hirosawa, Wako, Saitama, 351-0198, Japan.; Electrical and Electronic Engineering and Information Systems, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo, 113-8656, Japan.
Publikováno v:
Advanced materials (Deerfield Beach, Fla.) [Adv Mater] 2022 Feb; Vol. 34 (6), pp. e2107758. Date of Electronic Publication: 2021 Nov 30.
Autor:
Lee S; Department of Electrical Engineering and Information Systems, School of Engineering, The University of Tokyo,7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan., Franklin S; Institute for Cognitive Systems, Department of Electrical and Computer Engineering, Technical University of Munich, Karlstraße 45/II, 80333 München, Germany., Hassani FA; Department of Electrical Engineering and Information Systems, School of Engineering, The University of Tokyo,7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan., Yokota T; Department of Electrical Engineering and Information Systems, School of Engineering, The University of Tokyo,7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan., Nayeem MOG; Department of Electrical Engineering and Information Systems, School of Engineering, The University of Tokyo,7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan., Wang Y; Department of Electrical Engineering and Information Systems, School of Engineering, The University of Tokyo,7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan., Leib R; Neuromuscular Diagnostics, Department of Sport and Health Sciences, Technical University of Munich, Georg-Brauchle-Ring 60/62, 80992 München, Germany., Cheng G; Institute for Cognitive Systems, Department of Electrical and Computer Engineering, Technical University of Munich, Karlstraße 45/II, 80333 München, Germany., Franklin DW; Neuromuscular Diagnostics, Department of Sport and Health Sciences, Technical University of Munich, Georg-Brauchle-Ring 60/62, 80992 München, Germany., Someya T; Department of Electrical Engineering and Information Systems, School of Engineering, The University of Tokyo,7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan. someya@ee.t.u-tokyo.ac.jp.; Institute for Advanced Study, Technical University of Munich, Lichtenbergstrasse 2a, 85748 Garching, Germany.
Publikováno v:
Science (New York, N.Y.) [Science] 2020 Nov 20; Vol. 370 (6519), pp. 966-970.
Autor:
Nayeem MOG; Department of Electrical Engineering and Information Systems, School of Engineering, The University of Tokyo, 113-8656 Bunkyo-ku, Tokyo, Japan., Lee S; Department of Electrical Engineering and Information Systems, School of Engineering, The University of Tokyo, 113-8656 Bunkyo-ku, Tokyo, Japan., Jin H; Department of Electrical Engineering and Information Systems, School of Engineering, The University of Tokyo, 113-8656 Bunkyo-ku, Tokyo, Japan., Matsuhisa N; Department of Electrical Engineering and Information Systems, School of Engineering, The University of Tokyo, 113-8656 Bunkyo-ku, Tokyo, Japan., Jinno H; Department of Electrical Engineering and Information Systems, School of Engineering, The University of Tokyo, 113-8656 Bunkyo-ku, Tokyo, Japan.; Center for Emergent Matter Science, RIKEN, 351-0198 Wako, Saitama, Japan., Miyamoto A; Department of Electrical Engineering and Information Systems, School of Engineering, The University of Tokyo, 113-8656 Bunkyo-ku, Tokyo, Japan., Yokota T; Department of Electrical Engineering and Information Systems, School of Engineering, The University of Tokyo, 113-8656 Bunkyo-ku, Tokyo, Japan., Someya T; Department of Electrical Engineering and Information Systems, School of Engineering, The University of Tokyo, 113-8656 Bunkyo-ku, Tokyo, Japan; someya@ee.t.u-tokyo.ac.jp.; Center for Emergent Matter Science, RIKEN, 351-0198 Wako, Saitama, Japan.; Thin-Film Device Laboratory, RIKEN, 351-0198 Wako, Saitama, Japan.
Publikováno v:
Proceedings of the National Academy of Sciences of the United States of America [Proc Natl Acad Sci U S A] 2020 Mar 31; Vol. 117 (13), pp. 7063-7070. Date of Electronic Publication: 2020 Mar 18.
Autor:
Zheng, Bowen1 (AUTHOR), Guo, Ruisheng1 (AUTHOR) guoruisheng@nwpu.edu.cn, Dou, Xiaoqiang1 (AUTHOR), Fu, Yueqing1 (AUTHOR), Yang, Bingjun2 (AUTHOR) yangbj@licp.cas.cn, Liu, Xuqing1,3 (AUTHOR) xqliu@nwpu.edu.cn, Zhou, Feng3,4 (AUTHOR)
Publikováno v:
Nano-Micro Letters. 8/13/2024, Vol. 16 Issue 1, p1-16. 16p.
Autor:
Jiang Z; Thin-Film Device Laboratory, RIKEN, 2-1 Hirosawa, Wako, Saitama, 351-0198, Japan.; Electrical and Electronic Engineering and Information Systems, The University of Tokyo, 7-3-1 Bunkyo-ku, Tokyo, 113-8656, Japan., Nayeem MOG; Electrical and Electronic Engineering and Information Systems, The University of Tokyo, 7-3-1 Bunkyo-ku, Tokyo, 113-8656, Japan., Fukuda K; Thin-Film Device Laboratory, RIKEN, 2-1 Hirosawa, Wako, Saitama, 351-0198, Japan.; Center for Emergent Matter Science, RIKEN, 2-1 Hirosawa, Wako, Saitama, 351-0198, Japan., Ding S; College of Materials and Environmental Engineering, Hangzhou Dianzi University, Hangzhou, 310-018, P. R. China., Jin H; Electrical and Electronic Engineering and Information Systems, The University of Tokyo, 7-3-1 Bunkyo-ku, Tokyo, 113-8656, Japan., Yokota T; Electrical and Electronic Engineering and Information Systems, The University of Tokyo, 7-3-1 Bunkyo-ku, Tokyo, 113-8656, Japan., Inoue D; Center for Emergent Matter Science, RIKEN, 2-1 Hirosawa, Wako, Saitama, 351-0198, Japan., Hashizume D; Center for Emergent Matter Science, RIKEN, 2-1 Hirosawa, Wako, Saitama, 351-0198, Japan., Someya T; Thin-Film Device Laboratory, RIKEN, 2-1 Hirosawa, Wako, Saitama, 351-0198, Japan.; Electrical and Electronic Engineering and Information Systems, The University of Tokyo, 7-3-1 Bunkyo-ku, Tokyo, 113-8656, Japan.; Center for Emergent Matter Science, RIKEN, 2-1 Hirosawa, Wako, Saitama, 351-0198, Japan.
Publikováno v:
Advanced materials (Deerfield Beach, Fla.) [Adv Mater] 2019 Sep; Vol. 31 (37), pp. e1903446. Date of Electronic Publication: 2019 Jul 24.