Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Navas Khan Oratti Kalandar"'
Publikováno v:
2011 IEEE 13th Electronics Packaging Technology Conference.
Bare copper wire bond in ultra fine pitch application pose high challenge during reliability stress especially reliability test that involved high temperature and humidity stress such as Highly Accelerated Temperature/Humidity Stress Test (HAST). Ele
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a40aa341a69bce0851ec65bb7568da3b
https://doi.org/10.1109/eptc.2011.6184435
https://doi.org/10.1109/eptc.2011.6184435
Publikováno v:
2011 IEEE 13th Electronics Packaging Technology Conference.
As the semiconductor packaging industry continues to lower its manufacturing costs, concerted efforts in the supply chain focusing on using copper (Cu) as wire bond interconnects has intensified to an unprecedented level. In our previous study we sho
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d11ac5afd3cfe03577ff356330eb02d4
https://doi.org/10.1109/eptc.2011.6184522
https://doi.org/10.1109/eptc.2011.6184522