Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Nathan Whitchurch"'
Autor:
KiYeul Yang, Nathan Whitchurch, Michael G. Kelly, Curtis Zwenger, George J. Scott, TaeKyeong Hwang, WonMyoung Ki, JongHyun Jeon, JaeHun Bae
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
As the costs of advanced node silicon have risen sharply with the 7 and 5-nanometer nodes, advanced packaging is coming to a crossroad where it is no longer fiscally prudent to pack all desired functionality into a single die. While single-die packag
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5f8fc9cf35c1f1a5a48418753c05f7ca
https://doi.org/10.1109/ectc32862.2020.00145
https://doi.org/10.1109/ectc32862.2020.00145
Publikováno v:
International Symposium on Microelectronics. 2017:000176-000181
A method for directly measuring the silicon strain in a flip chip ball grid array (FCBGA) package is disclosed. The method uses anisotropically etched holes in the die backside to reveal fiducial crosses on the front side of the die. A geometric mode
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3f47e447135e59035e77a460a5762acf
https://doi.org/10.4071/isom-2017-wa14_097
https://doi.org/10.4071/isom-2017-wa14_097
Publikováno v:
2018 19th International Conference on Electronic Packaging Technology (ICEPT).
As the high demand of high power and high current in power discrete packages, products are applying the bigger die size but are limited by the same package footprint. The bigger die size requires bigger exposed pad(e-pad) size but limited by given fo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3af851a1ad57336225239f2224771277
https://doi.org/10.1109/icept.2018.8480692
https://doi.org/10.1109/icept.2018.8480692