Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Nathan C. Crawford"'
Autor:
Thomas J. Kolibaba, Callie I. Higgins, Nathan C. Crawford, Joseph R. Samaniuk, Jason P. Killgore
Publikováno v:
Advanced Materials Technologies. 8
Publikováno v:
Chemical Engineering Science. 182:108-118
In this paper we develop a computational model for the mixing and transport of a dilute biomass slurry. The objective was to create a sufficiently simple and efficient model for biomass transport that can be coupled with reaction models for the study
Publikováno v:
Chemical Engineering Science. 144:310-320
Thorough mixing during biochemical deconstruction of biomass is crucial for achieving maximum process yields and economic success. However, due to the complex morphology and surface chemistry of biomass particles, biomass mixing is challenging and cu
Publikováno v:
Biomass and Bioenergy. 85:126-134
Continuous and reliable feeding of biomass is essential for successful biofuel production. However, the challenges associated with biomass solids handling are commonly overlooked. In this study, we examine the effects of preprocessing (particle size
Publikováno v:
Fuel Processing Technology. 140:46-56
Due to its low density and poor flowability, raw biomass may not be an economically viable feedstock for the production of biofuels. However, mechanical densification can be employed to improve its viability. In this study, the flow properties (compr
Publikováno v:
Langmuir. 29:12915-12923
Chemical mechanical polishing (CMP) is an essential technology used in the semiconductor industry to polish and planarize a variety of materials for the fabrication of microelectronic devices (e.g., computer chips). During the high shear (~1,000,000
Publikováno v:
Colloids and Surfaces A: Physicochemical and Engineering Aspects. 436:87-96
During the chemical mechanical polishing (CMP) process, it is believed that shear thickening of the slurry, caused by particle agglomeration, has the potential to result in a significant increase in particle-induced surface defects (i.e. scratches, g
Autor:
David Boldridge, Nathan C. Crawford, Matthew W. Liberatore, Seong H. Kim, R. Williams, Benjamin Yohe
Publikováno v:
Rheologica Acta. 52:499-513
Chemical mechanical polishing is a fundamental technology used in the semiconductor manufacturing industry to polish and planarize a wide range of materials for the fabrication of microelectronic devices. During the high-shear (∼1,000,000 s−1) po
Autor:
Daniel J. Schell, James J. Lischeske, Edward J. Wolfrum, Nathan C. Crawford, Erik M. Kuhn, Melvin P. Tucker, James D. McMillan, Nicholas J. Nagle
Publikováno v:
Biotechnology for Biofuels
Background Pretreatment is a critical step in the biochemical conversion of lignocellulosic biomass to fuels and chemicals. Due to the complexity of the physicochemical transformations involved, predictively scaling up technology from bench- to pilot
Publikováno v:
Rheologica Acta. 51:637-647
Chemical mechanical polishing (CMP) is a fundamental technology used in the semiconductor manufacturing industry to polish and planarize electronic materials. During the high shear (≥1,000,000 s − 1) polishing process, it is hypothesized that ind