Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Nathalie Olschewski"'
Autor:
Günter Hess, Nathalie Olschewski, Ronny Walter, Markus Renno, Torsten Reichardt, Mathias Irmscher, Thomas Leutbecher, Florian Letzkus, Holger Seitz, Jörg Butschke, Helmut Popp
Publikováno v:
SPIE Proceedings.
Continuous reduction of feature size in semiconductor industry and manufacturing integrated circuits at low costs requires new and innovative technology to overcome existing limitations of optics. Tremendous progress in key areas like EUVL light sour
Autor:
Christian Wies, Ronny Walter, Nathalie Olschewski, Markus Renno, Günter Hess, Konrad Knapp, Holger Seitz, Thorsten Reichardt, Hans Becker, Thomas Leutbecher, Ute Buttgereit, Rainer Lebert, Frank Sobel
Publikováno v:
SPIE Proceedings.
Mask Blanks for EUV Lithography require a lot of new properties and features compared to standard Chrome-on-Glass blanks. Starting from completely new low thermal expansion substrate materials with significantly improved surface quality over multilay
Autor:
Markus Renno, Nathalie Olschewski, Thorsten Reichardt, Holger Seitz, Hans Becker, Rainer Lebert, Thomas Leutbecher, Ute Buttgereit, Konrad Knapp, Guenter Hess, Christian Wies, Frank Sobel, Ronny Walter
Publikováno v:
SPIE Proceedings.
Mask Blanks for EUV Lithography require a lot of new properties and features compared to standard Chrome-on-Glass mask blanks. SCHOTT Lithotec has introduced all relevant technology steps to manufacture EUV mask blanks. Starting from completely new l
Autor:
Joerg Butschke, Corinna Koepernik, Markus Renno, Torsten Reichardt, Lutz Aschke, Holger Seitz, Florian Letzkus, Nathalie Olschewski, Konrad Knapp, Ute Buttgereit, Frank Sobel, Guenter Hess, Hans Willy Becker
Publikováno v:
SPIE Proceedings.
EUV Lithography requires high end quality defect free layers from the backside coating to the absorber stack. Low thermal expansion materials (LTEM) substrates with super flat surfaces are already available with low defect backside coating for E-Chuc
Autor:
Frank Schmidt, Hans Willy Becker, Holger Seitz, Konrad Knapp, Pascal Schley, Guenter Hess, Frank Sobel, Ute Buttgereit, Nathalie Olschewski, Markus Renno
Publikováno v:
SPIE Proceedings.
Schott's already commercially available two layer Ta/SiO2 phase shift system can be tuned from 6% up to 30% transmission for 157, 193 and 248 nm lithography wavelengths. Thus one film patterning process provides a wide product range. Dry etch process
Autor:
Lutz Aschke, Hans W. Becker, Falk Friemel, Thomas Leutbecher, Nathalie Olschewski, Markus Renno, Frauke Rueggeberg, Mario Schiffler, Frank Schmidt, Frank Sobel, Kurt Walter, Guenter Hess, Frank Lenzen, Konrad Knapp, Jochen Alkemper, Hrabanus Hack, Klaus Megges, Ina Mitra, Rolf Mueller, Uwe Nolte, Joerg Schumacher, Wolfgang Pannhorst
Publikováno v:
SPIE Proceedings.
Autor:
Mario Schiffler, Steffen Kirchner, Hans Willy Becker, Bernhard Jagle, Lutz Aschke, Markus Renno, Guenter Hess, Ute Buttgereit, Konrad Knapp, Larissa Juschkin, Nathalie Olschewski, Frauke Ruggeberg, Thomas Leutbecher, Christian Wies, Frank Sobel, Kurt Walter, Rainer Lebert
Publikováno v:
Scopus-Elsevier
Schott Lithotec has introduced all relevant technology steps to manufacture EUV mask blanks in its advanced quality mask blank manufacturing line -- ranging from Low Thermal Expansion Material (LTEM) high quality substrate polishing to low defect bla