Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Natalia M. Dushkina"'
Autor:
Tariq H. Gilani, Natalia M. Dushkina
Publikováno v:
Education and Training in Optics and Photonics.
Autor:
Natalia M. Dushkina
Publikováno v:
Education and Training in Optics and Photonics.
Autor:
Jean-Marie Buchilly, Christophe Boillat, Frank Ruediger Wagner, Natalia M. Dushkina, Bernold Richerzhagen
Publikováno v:
SPIE Proceedings.
The incessantly growing demands for higher speed of the wireless telecommunications and more compact devices require using of thin compound semiconductor wafers. The dicing is the very last process of the wafer manufacturing. At this stage the IC pat
Publikováno v:
International Congress on Applications of Lasers & Electro-Optics.
GaAs wafers are fragile and brittle and, therefore, the well-developed dicing saw technique, which is widely used in the silicon industry, faces serious problems when used for dicing GaAs wafers. GaAs wafers are very sensitive to changes in the dicin
Publikováno v:
SPIE Proceedings.
Thin (≃1.5 μm) CdS films were prepared on glass by laser ablation using fluences of 2-5 Jcm -2 . We demonstrate that such an increase of the laser fluence turns the orientation of the c-axis of the films from perpendicular to parallel with respect