Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Naskar Sudipto"'
Autor:
James S. Clarke, M. Harmes, Mona Mayeh, Hazel Lang, Hui Jae Yoo, Naskar Sudipto, Seung Hoon Sung, Bojarski Stephanie A, John J. Plombon, Colin T. Carver, Kevin L. Lin, Manish Chandhok, B. Krist, Jasmeet S. Chawla
Publikováno v:
2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM).
Nickel silicide is an attractive option for interconnects at small dimensions because of its short electron mean free path and good electromigration behavior. Nickel silicide interconnects can be integrated using either a subtractive or damascene pro
Autor:
Naskar, Sudipto
Despite the availability of high-speed microprocessors, the speed of the present day computers are becoming limited by copper interconnect time delay. Thus, to enhance bandwidth, waveguide optical interconnects are being investigated as replacements
Externí odkaz:
http://rave.ohiolink.edu/etdc/view?acc_num=case1123163431
Autor:
Lin, Kevin L., Bojarski, Stephanie A., Carver, Colin T., Chandhok, Manish, Chawla, Jasmeet S., Clarke, James S., Harmes, Michael, Krist, Brian, Lang, Hazel, Mayeh, Mona, Naskar, Sudipto, Plombon, John J., Sung, Seung Hoon, Yoo, Hui Jae
Publikováno v:
2015 IEEE International Interconnect Technology Conference & 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM); 2015, p169-172, 4p
Autor:
Grego, Sonia, Naskar, Sudipto, Patel, Aarish M., Huffman, Alan, Bower, Christopher A., Stoner, Brian R.
Publikováno v:
Proceedings of SPIE; Nov2006, Issue 1, p61230D-61230D-11, 11p
Autor:
Naskar, Sudipto, Wolter, Scott D., Bower, Christopher A., Stoner, Brian R., Glass, Jeffrey T.
Publikováno v:
Applied Physics Letters; 12/26/2005, Vol. 87 Issue 26, p261907, 3p, 1 Diagram, 3 Graphs