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pro vyhledávání: '"Naru Tokunaga"'
Publikováno v:
Journal of Materials Research and Technology, Vol 30, Iss , Pp 9531-9541 (2024)
This study investigates the microstructural evolution and growth behavior of intermetallic compound (IMC) layers in the Cu/(Sn-yAg, y = 0.29–2.00 wt%) system during isothermal aging within the temperature range of 433–473 K. Through systematic va
Externí odkaz:
https://doaj.org/article/1556f36ea8c942839425ae0f2cc5e373