Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Naomi Lollis"'
Autor:
Himani Sharma, Holger Brumm, Pulugurtha Markondeya Raj, Mitch Weaver, Saumya Gandhi, Rao Tummala, Naomi Lollis, Robert Grant Spurney, Matthew D. Romig
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 9:1466-1472
High-density, point-of-load (PoL) power conversion and power delivery are required to continue scaling electronic systems with increased functionality, more bandwidth, and smaller sizes. To meet the demands of these highly complex and miniaturized el
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f5cf1699d5f81b4f0b2957ee280a350a
https://doi.org/10.1109/tcpmt.2019.2923698
https://doi.org/10.1109/tcpmt.2019.2923698
Autor:
Himani Sharma, Holger Brumm, Saumya Gandhi, Rao Tummala, Naomi Lollis, Mitch Weaver, Markondeya Raj Pulugurtha, Robert Grant Spurney, Matthew D. Romig
Publikováno v:
Journal of Electronic Materials. 47:5632-5639
High-density passive components are needed for continued miniaturization of complex high-performance electronic systems. Tantalum (Ta) capacitors provide some of the highest volumetric densities achieved due to their combination of high-surface area
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d9ab737831fd1acd80b50c53cce47358
https://doi.org/10.1007/s11664-018-6466-4
https://doi.org/10.1007/s11664-018-6466-4
Autor:
Himani Sharma, Robert Grant Spurney, Saumya Gandhi, Matthew D. Romig, Markondeya Raj Pulugurtha, Holger Brumm, Mitch Weaver, Rao Tummala, Naomi Lollis
Publikováno v:
Microelectronic Engineering. 247:111593
Increasingly dense microprocessors will require high-density passive components that can enable integrated power delivery with larger conversion ratios and higher output currents. Of these, nanoparticle-based tantalum capacitors can provide some of t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f4c44d0b72888ad98292adacb395e97d
https://doi.org/10.1016/j.mee.2021.111593
https://doi.org/10.1016/j.mee.2021.111593
Autor:
Himani Sharma, Mitch Weaver, Rao Tummala, Naomi Lollis, Saumya Gandhi, Matthew D. Romig, Robert Grant Spurney, Markondeya Raj Pulugurtha
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Aluminum capacitors provide a superior combination of high volumetric density owing to their high-surface area structure and high voltage-stability owing to their paraelectric, natural oxide dielectric. However, these capacitors are currently not com
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3a4a9517827960ccf3ec94335d364012
https://doi.org/10.1109/ectc.2018.00216
https://doi.org/10.1109/ectc.2018.00216
Autor:
Pulugurtha Markondeya Raj, Saumya Gandhi, Robert Grant Spurney, Rao Tummala, Naomi Lollis, Matthew D. Romig, Himani Sharma
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
This paper describes an innovative approach to develop high density and ultra-thin solid aluminum capacitors for high voltage automotive applications that sustain high temperatures. Form factors of less than 100 µm thickness are achieved with densit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::02fd3e029b6492b285b605f418b244f1
https://doi.org/10.1109/ectc.2017.95
https://doi.org/10.1109/ectc.2017.95
Autor:
Rao Tummala, Naomi Lollis, Christoph Schnitter, Nathan Neuhart, Himani Sharma, P. M. Raj, Kamil-Paul Rataj, Saumya Gandhi, Frank Stepniak, Matthew D. Romig, Parthasarathi Chakraborti
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
This paper demonstrates silicon-integrated, thinfilm, high-density tantalum capacitors for integrated power modules. The capacitors in form-factors of less than 75µm showed stable capacitance densities of more than 0.3 µF/mm2 with leakage of less t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::100fa4c6fb222f3c0c793fdcac2d40d8
https://doi.org/10.1109/ectc.2016.270
https://doi.org/10.1109/ectc.2016.270
Autor:
Spurney, Robert Grant, Sharma, Himani, Raj, Pulugurtha Markondeya, Tummala, Rao, Lollis, Naomi, Weaver, Mitch, Romig, Matt, Gandhi, Saumya, Brumm, Holger
Publikováno v:
IEEE Transactions on Components, Packaging & Manufacturing Technology; Aug2019, Vol. 9 Issue 8, p1466-1472, 7p
Autor:
Spurney, Robert Grant, Sharma, Himani, Pulugurtha, Markondeya Raj, Tummala, Rao, Lollis, Naomi, Weaver, Mitch, Gandhi, Saumya, Romig, Matt, Brumm, Holger
Publikováno v:
Journal of Electronic Materials; Sep2018, Vol. 47 Issue 9, p5632-5639, 8p