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Autor:
Daisuke Kitayama, Miyuki Akazawa, Hiroyuki Sato, Masaya Tanaka, Kouji Sakamoto, Hiroshi Mawatari, Yumi Okazaki, Ryohhei Kasai, Hiroshi Kudo, Shouhei Yamada, Toshio Sasao, Susumu Tashiro, Naoki Oota, Satoru Kuramochi, Haruo Iida, Takamasa Takano, Mitsuhiro Takeda, Jyunichi Suyama
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
An enhanced redistribution layer architecture has been developed in which the Cu wires are directly covered with a double layer consisting of two types of dielectrics by using a semi-additive process. The double layer enhanced the thermal and electri
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c989cb81643fa8b51aa38b80758c324b
https://doi.org/10.1109/ectc.2016.69
https://doi.org/10.1109/ectc.2016.69
