Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Naoki Kanagawa"'
Publikováno v:
2019 International Wafer Level Packaging Conference (IWLPC).
In recent years, the demands for higher speed and smaller and thinner semiconductor devices are increasing, and the demand for fan-out wafer level package (FOWLP) technology is expected to grow in the future [1]–[3]. Resin formulation for FOWLP is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::df101dcdbc776f660ed13aea44ad2037
https://doi.org/10.23919/iwlpc.2019.8913990
https://doi.org/10.23919/iwlpc.2019.8913990
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Recent developments in high-speed communication technology have accelerated reductions in the size and thickness of semiconductor packages. Fan-out wafer level packaging (FO-WLP) is an emerging packaging trend. Considering cost and scalability, there
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2235dfdd5d8c7f5d8545c5484b3b0d6a
https://doi.org/10.1109/ectc.2019.00160
https://doi.org/10.1109/ectc.2019.00160
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
In this research, a combination of thermo-sonic bonding (TSB) process and non-conductive film (NCF) material was used to fabricate vertically stacked through silicon via (TSV) assemblies. TSB is particularly attractive TSV assembly process because it
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::747b31c2b1cd01c60f4c866e9a9c7dfd
https://doi.org/10.1109/ectc.2018.00307
https://doi.org/10.1109/ectc.2018.00307
Autor:
Naoki Kanagawa, Shigemasa Takai
Publikováno v:
International Journal of Control. 88:2598-2610
This paper considers a failure diagnosis problem for discrete event systems subject to permanent sensor failures. A notion of diagnosability subject to permanent sensor failures is introduced with respect to a certain nondeterministic observation mas
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a3d16c085f2d019596fb5cafed382b0b
https://doi.org/10.1080/00207179.2015.1051587
https://doi.org/10.1080/00207179.2015.1051587
Autor:
Naoki Kanagawa, Shigemasa Takai
Publikováno v:
ETFA
In this paper, we consider a failure diagnosis problem for discrete event systems subject to permanent sensor failures. A notion of diagnosability subject to permanent sensor failures is introduced with respect to a certain nondeterministic observati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2076cbe9aa504cd0d400c1c0618bed24
https://doi.org/10.1109/etfa.2014.7005103
https://doi.org/10.1109/etfa.2014.7005103
Publikováno v:
Computers & Electrical Engineering. 23:407-414
A new high-density non-volatile multiple-valued content-addressable memory (CAM) is proposed for highly parallel search operations. Multiple-valued stored data correspond to the threshold voltage of a floating-gate MOS transistor, so that the cell ci
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::acbb6b523ddb568705eeacf0c84f60ef
https://doi.org/10.1016/s0045-7906(97)00027-x
https://doi.org/10.1016/s0045-7906(97)00027-x
Publikováno v:
IEEE Journal of Solid-State Circuits. 31(11):1669-1674
A new high-density multiple-valued content-addressable memory (CAM) is proposed to perform highly parallel search operations in a limited chip area. The number of cells in the CAM is reduced by the use of multiple-valued data representation. Moreover
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::80851a37c3607e7713cb1253b68b6948
http://hdl.handle.net/10097/47727
http://hdl.handle.net/10097/47727
Publikováno v:
1996 IEEE International Solid-State Circuits Conference. Digest of TEchnical Papers, ISSCC.
Parallel search and parallel comparison are major advantages of content-addressable memories (CAMs) over random-access memories. However, a CAM is more complex and has lower storage density than a conventional address-based memory because of the over
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9cd1ca5769f3e4c8d5e0a3038743f52f
https://doi.org/10.1109/isscc.1996.488616
https://doi.org/10.1109/isscc.1996.488616
Conference
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