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pro vyhledávání: '"Naohito Ogiso"'
Autor:
Yasuhito Yagi, Yohei Yamada, Junji Noguchi, Nobuhiro Konishi, Naohito Ogiso, Tadakazu Miyazaki, Shoji Asaka, Kiyomi Katsuyama
Publikováno v:
Journal of The Electrochemical Society. 155:H301
Using Cu/SiOC interconnects, we investigated the relationship between the time-dependent dielectric breakdown (TDDB) reliability and the cleaning process in copper chemical-mechanical polishing (CMP). We found that the formation of a nonuniform coppe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7b23dddb2cc6a118180dcaa3f6231282
https://doi.org/10.1149/1.2888470
https://doi.org/10.1149/1.2888470
